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Water-cooling heat dissipation plate

A technology of water-cooled heat sink and main board, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electric solid devices, etc. It can solve the problems of small usage occasions, and achieve the effects of convenient processing, heat absorption, and smooth flow

Inactive Publication Date: 2018-08-31
江苏奥尼克电气股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the limitation of volume and cost, evaporative cooling can be used in very small places

Method used

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  • Water-cooling heat dissipation plate
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Embodiment Construction

[0012] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0013] Such as figure 1 with figure 2 Shown, a kind of water-cooled radiator, comprises mainboard 1; Mainboard 1 has a sinking groove, and sinking groove is circular; Mainboard 1 is provided with the water inlet and the water outlet that are connected with sinking groove; Mainboard 1 water inlet, water outlet are opened There are internal threads; the water inlet and outlet of the main board 1 are connected with a water inlet pipe 3 and a water outlet pipe 4...

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Abstract

The invention discloses a water-cooling heat dissipation plate and belongs to the technical field of heat dissipation of electronic device. The plate comprises a main plate. A sinking groove is arranged in the main plate. A water inlet and a water outlet, communicating with the sinking groove, are arranged in the main plate. A cover plate is embedded in the sinking groove of the main plate. An annular groove is arranged in the inner end face of the cover plate. Two ends of the annular groove communicate with the water inlet and water outlet of the main plate. The beneficial effects are that through the waterway formed by the annular groove, smooth flowing is achieved; the waterway is arranged on the cover plate, so convenient processing is achieved and intensity of the main plate and elements thereon are not affected; heat adsorption of the main plate is facilitated; and an objective of reducing thermal resistance is achieved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic devices, in particular to a water-cooled heat dissipation plate. Background technique [0002] The main cooling methods of existing electronic devices are: air natural convection and radiation, air cooling plate (forced air cooling with heat sink), liquid cooling (forced indirect liquid cooling of water cooling plate), evaporative cooling (heat pipe phase change cooling). Among them, evaporative cooling and liquid cooling have the highest heat dissipation efficiency. However, due to the limitation of volume and cost, evaporative cooling can be used in very small places. In contrast, water-cooled plate cooling is widely used in heat dissipation occasions with high heat flux density due to its high heat dissipation efficiency, small size of heat dissipation substrate, and compact structure of heat dissipation system. [0003] With the rapid development of power electronics t...

Claims

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Application Information

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IPC IPC(8): H05K7/20H01L23/473
CPCH01L23/473H05K7/20272
Inventor 张晓民
Owner 江苏奥尼克电气股份有限公司