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Holding arrangement for holding substrate, carrier for supporting substrate, deposition system, method for holding substrate and method for releasing substrate

A technology for substrates and carriers, applied in the fields of maintaining arrangement for maintaining substrates, carriers for supporting substrates, deposition systems, maintaining substrates and releasing substrates, which can solve problems such as increased cracking

Active Publication Date: 2021-08-03
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Bumps can in turn pose problems due to increased likelihood of breakage

Method used

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  • Holding arrangement for holding substrate, carrier for supporting substrate, deposition system, method for holding substrate and method for releasing substrate
  • Holding arrangement for holding substrate, carrier for supporting substrate, deposition system, method for holding substrate and method for releasing substrate
  • Holding arrangement for holding substrate, carrier for supporting substrate, deposition system, method for holding substrate and method for releasing substrate

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Embodiment Construction

[0026] Reference will now be made in detail to various embodiments of the disclosure, one or more examples of which are illustrated in the drawings. In the following description of the drawings, the same reference numerals designate the same components. In general, only the differences between the respective embodiments will be described. Each example is provided merely to explain the present disclosure, not meant to limit the present disclosure. Additionally, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield still other embodiments. The description is intended to cover such adaptations and variations.

[0027] The trend towards larger and also thinner substrates can cause bulging of the substrate due to stresses applied to the substrate, for example during the deposition process. A support system (such as a clamp) that holds the substrate during the deposition process introduces protrusions on the s...

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Abstract

The present disclosure provides a retention arrangement (100). A holding arrangement (100) for holding a substrate comprising: a main body portion (110) having a first side (112); a dry adhesive material (120) ( 120) disposed on the first side (112) of the main body portion (110); a seal (130) surrounding the dry adhesive (120) and configured to be on the first side (112) A vacuum area is provided, wherein a dry adhesive (120) is provided in the vacuum area; and a conduit (140) is used to evacuate the vacuum area.

Description

technical field [0001] Embodiments of the present disclosure relate to a holding arrangement for holding a substrate, a carrier for supporting a substrate, a vacuum processing system, a method for holding a substrate and a method for releasing a substrate. Embodiments of the present disclosure relate in particular to a holding arrangement for holding a substrate during processing of a substrate in a vacuum processing chamber, a carrier for supporting a substrate in a vacuum processing chamber, a vacuum processing system comprising a vacuum processing chamber, a A method for holding a substrate during substrate processing in a vacuum processing chamber and a method for releasing a substrate after substrate processing in a vacuum processing chamber. In particular, substrate processing may include deposition processes, such as sputter deposition processes. Background technique [0002] Techniques for depositing layers on a substrate include, for example, thermal evaporation, c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/50B23Q3/08B65G49/06C03C17/00
CPCB65G49/062B65G2249/045H01L21/6838H01L21/6875C23C14/50B23Q3/084B65G2201/022C23C16/4581C23C16/4586C23C16/4583H01L21/68757H01L21/68785C23C14/228
Inventor 西蒙·刘
Owner APPLIED MATERIALS INC