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Detection method for sub-surface damage layer thickness of silicate glass

A silicate glass, subsurface damage technology, applied in measuring devices, instruments, etc., can solve problems such as cracks and residual stress not being amplified, micron-scale crack shape, position detection difficulties, and imperfect response mechanism research. The effect of high detection accuracy

Active Publication Date: 2018-09-14
CHINA BUILDING MATERIALS ACAD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem with this method is that the extremely fine cracks and residual stress are not enlarged during the processing, and cannot be found with roughness measuring tools or profilers
However, due to the incomplete research on the response mechanism of detection media such as sound waves, light fields, magnetic fields, and rays to micron-scale defects, the detection of the shape and position of micron-scale cracks is still a difficult problem

Method used

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  • Detection method for sub-surface damage layer thickness of silicate glass

Examples

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Comparison scheme
Effect test

Embodiment 1

[0033] A method for detecting the thickness of a silicate glass subsurface damage layer proposed by an embodiment of the present invention, which includes:

[0034] Use a cutting machine to cut a bevel on the silicate glass sample, the inclination angle α is 175°, rinse the cutting oil and cutting particles on the surface of the sample with deionized water, and then place the sample in absolute ethanol for ultrasonic cleaning for 15 minutes. Ultrasonic frequency 40Hz;

[0035] Use a polishing machine to polish the inclined surface. The polishing medium is a fluid polishing liquid, and the polishing liquid is CeO 2 Suspension, suspension concentration is 200g / L, CeO2 The particle size is not more than 1 μm, and the polishing removal amount is 100 μm. Rinse the polishing liquid and polishing particles on the surface of the sample with deionized water, and then place the sample in absolute ethanol for ultrasonic cleaning. The ultrasonic frequency is 40 Hz and the cleaning time is...

Embodiment 2

[0039] A method for detecting the thickness of a silicate glass subsurface damage layer proposed by an embodiment of the present invention, which includes:

[0040] Use a cutting machine to cut a bevel on the silicate glass sample, the inclination angle α is 165°, rinse the cutting oil and cutting particles on the surface of the sample with deionized water, and then place the sample in absolute ethanol for ultrasonic cleaning for 10 minutes. Ultrasonic frequency 40Hz;

[0041] Use a polishing machine to polish the inclined surface. The polishing medium is a fluid polishing liquid, and the polishing liquid is Fe 2 o 3 Suspension, suspension concentration is 400g / L, Fe 2 o 3 The particle size is not more than 1 μm, and the polishing removal amount is 80 μm. Rinse the polishing solution and polishing particles on the surface of the sample with deionized water, and then place the sample in absolute ethanol for ultrasonic cleaning. The ultrasonic frequency is 80 Hz and the clean...

Embodiment 3

[0045] A method for detecting the thickness of a silicate glass subsurface damage layer proposed by an embodiment of the present invention, which includes:

[0046] Use a cutting machine to cut a bevel on the silicate glass sample, the inclination angle α is 160°, rinse the cutting oil and cutting particles on the surface of the sample with deionized water, and then place the sample in absolute ethanol for ultrasonic cleaning for 15 minutes. Ultrasonic frequency 80Hz;

[0047] Use a polishing machine to polish the inclined surface. The polishing medium is a fluid polishing liquid, and the polishing liquid is Fe 2 o 3 Suspension, suspension concentration is 300g / L, Fe 2 o 3 The particle size is not more than 1 μm, and the polishing removal amount is 80 μm. Rinse the polishing solution and polishing particles on the surface of the sample with deionized water, and then place the sample in absolute ethanol for ultrasonic cleaning. The ultrasonic frequency is 80 Hz and the clean...

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Abstract

The invention relates to a detection method for the sub-surface damage layer thickness of silicate glass, and the method comprises the steps: cutting a silicate glass sample to form a slope, and carrying out the cleaning and supersonic processing, wherein an inclination angle alpha is an inclined angle between the slope and a plane; polishing the slope, and carrying out the cleaning and supersonicprocessing; carrying out the acid-alkali-acid processing of the polished slope, and carrying out the cleaning, supersonic dehydration and drying; carrying out the high-temperature reduction of the dried sample, carrying out the cooling operation, and measuring the length L of a damage region on the slope, wherein the length L takes an intersection line of the plane with the slope as a start point, and takes an intersection line of a crack region with a region without a crack on the slope as the end point; and calculating the damage layer thickness D=L*sin(alpha). The method is suitable for the detection of the sub-surface damage layer thickness of silicate glass, is high in detection precision, and can achieve the engineering application.

Description

technical field [0001] The invention relates to a detection method for the thickness of the subsurface damaged layer of an optical element, in particular to a detection method for the thickness of the subsurface damaged layer of silicate glass. Background technique [0002] Usually, due to the properties of the glass itself, traditional processing such as cutting, grinding, polishing, etc. will cause a certain degree of damage to the sub-surface, and the existence of the damage layer will reduce the performance and life of the glass in subsequent use, for example, for For large optical components in space telescope systems, the degree and quantity of subsurface damage introduced during the manufacturing process determine the yield strength of the mirror. In the process, the subsurface cracks will further expand, resulting in the distortion of the mirror surface, which is difficult to meet the strict surface shape and flatness requirements. For another example, in the design...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B21/08B24B1/00
CPCB24B1/00G01B21/08
Inventor 廉姣刘畅薄铁柱李庆史小玄王辰刘辉
Owner CHINA BUILDING MATERIALS ACAD
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