A heating component, packaging device and packaging method

A technology for heating components and encapsulation methods, applied in chemical instruments and methods, lamination devices, electrical components, etc., can solve problems such as air bubbles, insufficient diffusion of filling glue, and damage of sealing glue, so as to reduce viscosity and solve the problem of insufficient diffusion Adequate, solve the effect of damage and defects

Active Publication Date: 2020-05-15
BOE TECH GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] In order to solve the above technical problems, embodiments of the present invention provide a heating assembly, a packaging device, and a packaging method. By rationally designing the light emitting type of the light source assembly, the first light is used to heat the first adhesive material, and the second light is used to cure the second light. The second adhesive material solves the problem of air bubbles caused by insufficient diffusion of the filler in the existing packaging technology, and at the same time solves the problem of damage and defects caused by the impact of the sealant on the filler

Method used

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  • A heating component, packaging device and packaging method
  • A heating component, packaging device and packaging method
  • A heating component, packaging device and packaging method

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Embodiment Construction

[0044] In order to make the purpose, technical solution and advantages of the present invention more clear, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined arbitrarily with each other.

[0045] The following specific embodiments provided by the present invention can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.

[0046] figure 1 A schematic structural diagram of a heating assembly provided by an embodiment of the present invention. The heating assembly 100 provided in this embodiment is used to heat the package of the DAM&FILL structure to achieve the purpose of effective packaging. The heating assembly 100 may include: a light source assembly 110 .

[0047] Wherein, the light source assemb...

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Abstract

The embodiment of the invention discloses a heating assembly, a packaging device and a packaging method. Wherein, the heating assembly is used to heat and cure the package, and the heating assembly includes: a light source assembly, used to emit the first light for heating the first adhesive material in the first area of ​​the package, and emit light to the first adhesive material in the package. The second adhesive material in the second region is cured by a second light, and the package is a component for packaging electronic devices. The embodiment of the present invention solves the problem caused by insufficient diffusion of the filling glue in the existing packaging technology by rationally designing the light emitting type of the light source component, using the first light to heat the first adhesive material, and using the second light to cure the second adhesive material. Bubble problem, and at the same time solve the problem of damage and defects caused by the impact of the sealing glue by the filling glue.

Description

technical field [0001] The present application relates to but not limited to the field of display technology, especially a heating assembly, packaging device and packaging method. Background technique [0002] With the development and mass production of electronic components, the packaging technology also develops accordingly. Organic Electroluminance Display (OLED) is usually packaged with DAM&FILL packaging technology. [0003] In the existing DAM&FILL packaging technology, there are two problems: one is the bubble problem caused by the insufficient diffusion of the filler (FILL), and the other is the impact of the diffusion of the filler (FILL) on the sealant (DAM), which will lead to The frame glue is damaged and defective. The above-mentioned packaging technology of DAM&FILL is contradictory to the improvement method of avoiding bubbles in the filling glue and avoiding damage to the sealing glue. If you want to avoid the bubbles of the filler, you need to reduce the v...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L51/52
CPCH01L21/67115H10K50/84H01L21/67126H10K50/8426B32B37/06B32B37/12B32B37/1207B32B37/1292B32B37/144B32B2037/1253B32B2457/206H10K71/00H10K50/841
Inventor 任锦宇宋勇志周波
Owner BOE TECH GRP CO LTD
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