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Packaged chip integrated with monopole antenna and processing method of packaged chip

A technology of monopole antenna and processing method, which is applied in the direction of antenna support/mounting device, antenna, resonant antenna, etc., can solve the problems of wafer consumption, loss, and enlarging package size, and achieve controllability and wide application The effect of promotional use

Active Publication Date: 2018-09-14
成都中宇微芯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current antenna is mainly based on the off-chip antenna, because the size of the on-chip antenna is large, and it needs to consume a large area of ​​wafers
When the chip is connected to the off-chip antenna, a gold wire jumper is required, and the gold wire jumper will cause additional loss
In addition, the gold wire connection method between the chip and the off-chip antenna makes the package size of the whole system larger, which is not conducive to the miniaturization of the system

Method used

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  • Packaged chip integrated with monopole antenna and processing method of packaged chip
  • Packaged chip integrated with monopole antenna and processing method of packaged chip
  • Packaged chip integrated with monopole antenna and processing method of packaged chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] Embodiments 1 and 2 are packaged chips for integrated monopole antennas without cutting, and the accuracy of the gold wire jumper can be guaranteed by designing the position of the positioning pad on the wafer.

[0057] The present invention also provides a processing method for processing the packaged chip of the integrated monopole antenna in the first embodiment and the second embodiment, including:

[0058] S111: Fix the bare chip on the substrate, and the bare chip is provided with a first radio frequency pad and a first positioning pad;

[0059] S121: Using a gold wire to bond and connect the first radio frequency pad to the first positioning pad, the gold wire connected between the first radio frequency pad and the first positioning pad forms a first monopole antenna;

[0060] S131: Package and solidify the bare chip, the first positioning pad, and the first monopole antenna to form a packaged chip integrating the monopole antenna.

[0061] The positioning pad c...

Embodiment 3

[0063] The embodiment of the present invention also provides a processing method for processing the packaged chip of the integrated monopole antenna in the third embodiment, including:

[0064] S112: Fix the bare chip on the substrate, the bare chip is provided with a first radio frequency pad, and the substrate is provided with a first positioning pad;

[0065] S122: Using a gold wire to bond and connect the first radio frequency pad to the first positioning pad, the gold wire connected between the first radio frequency pad and the first positioning pad forms a first monopole antenna;

[0066] S132: Package and solidify the bare chip, the first positioning pad, and the first monopole antenna to form a package chip integrating the monopole antenna.

[0067] In the packaged chip integrated with the monopole antenna provided by the embodiment of the present invention, there may be multiple radio frequency pads, multiple positioning pads, and multiple monopole antennas. The follo...

Embodiment 6

[0096] Embodiments 6 and 8 can cut out two packaged chips with integrated monopole antennas at one time, and the consistency of two identical chips can be better guaranteed.

[0097] The integrated monopole antenna package chip of the present invention may have multiple radio frequency pads, multiple positioning pads, and multiple monopole antennas. The various solutions above can be combined according to the actual situation, and can be applied to the situation of multiple monopole antennas, whether it is one-sided direction or multiple directions, it can be selected according to the situation. According to actual needs, a monopole antenna can also be bonded and connected to a radio frequency pad and multiple positioning pads to form an antenna array. The following examples are introduced:

[0098] For example, a monopole antenna array formed by several monopole antennas side by side, such as Figure 9 As shown, Embodiment 9 of the present invention also provides a packaged ...

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PUM

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Abstract

The invention relates to the technical field of chip processing and particularly discloses a packaged chip integrated with a monopole antenna and a processing method of the packaged chip. The packagedchip integrated with the monopole antenna comprises a bare chip fixed on a substrate, a radio frequency pad is arranged on the bare chip, and the packaged chip also comprises a positioning pad arranged on the bare chip or the substrate; the packaged chip also comprises the monopole antenna which is an arc metal wire, one end of the monopole antenna is in bonded connection with the radio frequencypad, the other end is in bonded connection with the positioning pad, and the bare chip, the positioning pad and the monopole antenna are all covered with a packaging adhesive. The metal wire is bonded to the designated position from the radio frequency pad of the bare chip, the monopole antenna is formed on the positioning pad and then covered with the packaging adhesive for curing to form the packaged chip integrated with the monopole antenna, so that controllability of the length of the metal wire and fixation of the metal wire can be realized, the packaging process has conditions of mass production and can be widely popularized.

Description

technical field [0001] The invention relates to the technical field of chip processing, in particular to a packaging chip for an integrated monopole antenna and a processing method thereof. Background technique [0002] A monopole antenna is a vertical quarter-wavelength antenna. The antenna is installed on a ground plane, the feed of the monopole antenna is carried out at the lower end, and the ground conductor of the feed line is connected to the platform. In free space, the radiation pattern of a quarter-wave monopole antenna in the vertical plane is similar in shape to that of a half-wave dipole antenna in the vertical plane, but without subsurface radiation. In the horizontal plane, vertical monopole antennas are omnidirectional. [0003] When millimeter-wave and terahertz integrated circuits are used as RF front-end applications, antennas are required to propagate signals. The current antennas are mainly off-chip antennas, because the size of the on-chip antenna is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/66H01L23/31H01L21/50H01Q1/22H01Q1/36H01Q9/30
CPCH01L23/66H01Q1/2283H01Q1/36H01Q9/30H01L21/50H01L23/3107H01L2223/6677H01L2224/49113H01L2224/4811H01L2224/48091H01L2224/48137H01L2924/19107H01L2924/00014
Inventor 刘伟
Owner 成都中宇微芯科技有限公司