Tin outlet nozzle automatic washing device and washing method thereof

Abstract

The invention discloses a tin outlet nozzle automatic washing device. The tin outlet nozzle automatic washing device comprises a tin soldering furnace, a soldering flux supplying device and an XY conveying platform, wherein at least one tin outlet nozzle is arranged on the tin soldering furnace; the tin soldering furnace comprises an oxide layer removing brush corresponding to the tin outlet nozzles and used for removing oxide layer at the tin outlet nozzles; the soldering flux supplying device is internally provided with soldering flux and is connected with the oxide layer removing brush so as to convey the soldering flux to the oxide layer removing brush; and the XY conveying platform is in drive connection with the tin soldering furnace and used for driving the tin soldering furnace tomove to the oxide layer removing brush, and moves relative to the oxide layer removing brush to achieve removal of the oxide layers. When the tin outlet nozzle automatic washing device works, tin waves are detected by a tin wave detection device, the oxide layers at the tin outlet nozzles are washed away automatically through the oxide layer removing brush, manual washing is replaced, high efficiency is achieved, and safety of personnel is ensured.

Description

technical field [0001] The invention relates to the technical field of SMT welding equipment, in particular to an automatic cleaning device for a tin nozzle and a cleaning method thereof. Background technique [0002] SMT is Surface Mount Technology, known as Surface Mount or Surface Mount Technology. It is the most popular technology and process in the electronic assembly industry. [0003] It is a circuit assembly technology that mounts non-lead or short-lead surface mount components on the surface of a printed circuit board or other substrates, and solders and assembles them by reflow soldering or dip soldering. [0004] However, in existing selective wave soldering, the tin nozzle part is in long-term contact with high-temperature liquid tin, and an oxide layer is formed at the outlet of the tin nozzle; the work of removing the oxide layer is manually removed, not only the removal efficiency is low, but also if the operation is improper, the staff will There is a high ...

AI Technical Summary

Problems solved by technology

[0004] However, in existing selective wave soldering, the tin tip part is in contact with high-temperature liquid tin for a long time, and an oxide layer is formed at the tin tip; the work of removing the oxide layer is manually removed, not only the removal efficiency is low, but also if the operation is improper, the staff will Severe burns, high risk factor; therefore improvement is necessary

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