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A kind of fpc flexible plate copper plating additive and preparation method thereof

An additive and flexible board technology, applied in the direction of the electrical connection of printed components, can solve the problems of unsuitable precision flexible circuit boards, copper thickness on the circuit board surface, long electroplating time, etc., to shorten the electroplating time, reduce the surface copper thickness, Excellent deep plating ability

Active Publication Date: 2019-09-13
深圳市星扬高新科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For a long time, the TP value (deep plating ability) of the copper plating additive used in the copper plating process of flexible circuit boards can only reach 100-150%, which makes the electroplating time of the process long, the efficiency is low, and the final result The surface copper of the produced circuit board is thicker, which is less and less suitable for the development trend of precision flexible circuit board technology

Method used

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  • A kind of fpc flexible plate copper plating additive and preparation method thereof
  • A kind of fpc flexible plate copper plating additive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] S1. Mix and stir 2kg of styrylphenol polyoxyethylene ether and 45kg of water until the styrylphenol polyoxyethylene ether is completely dissolved to obtain a primary mixture;

[0024] S2. Add 0.1kg ternary imidazole copolymer to the primary mixture and mix and stir until the ternary imidazole copolymer is completely dissolved to obtain a secondary mixture;

[0025] S3. Add 2 kg of modified polyether into the secondary mixture and mix and stir until the modified polyether is completely dissolved to obtain a tertiary mixture;

[0026] S4. Add 0.15 kg of sodium benzyl dithiopropane sulfonate to the three mixtures and mix and stir until the sodium benzyl dithiopropane sulfonate is completely dissolved to obtain the four mixtures;

[0027] S5. Add 0.02kg of yellow dye to the mixture for four times and mix and stir until the yellow dye is completely dissolved to obtain the mixture for five times;

[0028] S6. Add 45 kg of water to the mixture five times and stir for 30 minut...

Embodiment 2

[0030] S1. Mix and stir 1 kg of styrylphenol polyoxyethylene ether and 47 kg of water until the styrylphenol polyoxyethylene ether is completely dissolved to obtain a primary mixture;

[0031] S2. Add 0.2kg ternary imidazole copolymer to the primary mixture and mix and stir until the ternary imidazole copolymer is completely dissolved to obtain a secondary mixture;

[0032] S3. Add 3 kg of modified polyether into the secondary mixture and mix and stir until the modified polyether is completely dissolved to obtain a tertiary mixture;

[0033] S4. Add 0.2 kg of sodium benzyl dithiopropane sulfonate to the three mixtures and mix and stir until the sodium benzyl dithiopropane sulfonate is completely dissolved to obtain the four mixtures;

[0034] S5. Add 0.03kg of yellow dye to the mixture for four times and mix and stir until the yellow dye is completely dissolved to obtain the mixture for five times;

[0035] S6. Add 47kg of water to the mixture five times and stir for 30 minut...

Embodiment 3

[0037] S1. Mix and stir 5 kg of styrylphenol polyoxyethylene ether and 48 kg of water until the styrylphenol polyoxyethylene ether is completely dissolved to obtain a primary mixture;

[0038] S2. Add 0.2kg ternary imidazole copolymer to the primary mixture and mix and stir until the ternary imidazole copolymer is completely dissolved to obtain a secondary mixture;

[0039] S3. Add 5 kg of modified polyether into the secondary mixture and mix and stir until the modified polyether is completely dissolved to obtain a tertiary mixture;

[0040] S4. Add 0.3 kg of sodium benzyl dithiopropane sulfonate to the three mixtures and mix and stir until the sodium benzyl dithiopropane sulfonate is completely dissolved to obtain the four mixtures;

[0041] S5. Add 0.05kg of yellow dye to the mixture for four times and mix and stir until the yellow dye is completely dissolved to obtain the mixture for five times;

[0042] S6. Add 48 kg of water to the mixture five times and stir for 30 minu...

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Abstract

The invention relates to the technical field of circuit board metallization treatment, in particular to an FPC flexible board copper plating additive and a preparation method thereof. The additive comprises the following components of, by weight, 2-5 parts of polyether, 0.15-0.3 part of benzyl dithiopropane sodium sulfonate, 0.1-0.2 part of imidazole, 1-3 parts of phenol polyoxyethylene ether, 0.02-0.05 part of yellow dye and 90-96 parts of water. Compared with an existing copper plating additive, the maximum deep plating capacity of the copper plating additive can only reach 150%, and the copper plating additive has 180%-200% deep plating capacity. Under the premise of the same current density and keeping little difference in product performance, by using the additive to carry out the circuit of the flexible board, the electroplating time can be shortened and the production can be improved, and the additive can be suitable for copper plating of rolled copper.

Description

technical field [0001] The invention relates to the technical field of circuit board metallization treatment, in particular to an FPC flexible board copper plating additive and a preparation method thereof. Background technique [0002] FPC flexible circuit board hole metallization technology is one of the keys to flexible circuit board manufacturing technology. For a long time, the TP value (deep plating capacity) of the copper plating additive used in the copper plating process of flexible circuit boards can only reach 100-150%, which makes the electroplating time of the process long, the efficiency is low, and the final result The surface copper of the produced circuit board is relatively thick, which is less and less suitable for the development trend of precision flexible circuit board technology. Contents of the invention [0003] In view of the deficiencies in the above-mentioned prior art, one object of the present invention is to provide a copper plating additive...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38H05K3/42
Inventor 李亚全王荣茹周国新
Owner 深圳市星扬高新科技有限公司