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A method for separating and recycling quartz crystal resonator wafers

A technology of separation and recovery of quartz crystals, which is applied in semiconductor/solid-state device manufacturing, piezoelectric/electrostrictive device manufacturing/assembly, electrical components, etc. Poor characteristics, increased production costs and other problems, to achieve the effect of reduced adhesion strength, good effect and cost saving

Active Publication Date: 2020-01-24
黄山东晶电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, different defective products will be produced in dispensing and fine-tuning engineering, and these defective products are not caused by defective chips, but mainly caused by the state of glue dots, the state of chip mounting and other electrical characteristics
At present, the processing method for the defective products produced by the above dispensing and fine-tuning is directly scrapped, and the wafers cannot be recycled well. This processing method causes waste of materials and increases production costs.

Method used

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  • A method for separating and recycling quartz crystal resonator wafers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Embodiment 1: A method for separating and recovering quartz crystal resonator wafers, such as figure 1 As shown, including the following steps:

[0018] (1) Put the quartz crystal resonator into a soaking solution for 3.5 to 5 hours. The soaking solution is made by adding TFD4, acetone and sodium hydroxide to plasma water and mixing. The volume ratio of TFD4, acetone and plasma water is 1:8:12, the material-to-liquid ratio of the sodium hydroxide to the plasma water is 6:10 g / ml; the TFD4 is produced by the French company franklab.

[0019] (2) Put the immersed quartz crystal resonator into a container filled with hot water at a temperature of 50°C to 70°C and rinse for 4 to 6 minutes, shaking the container continuously during rinsing;

[0020] (3) Put the quartz crystal resonator treated with hot water into a container filled with cold water for rinsing for 4-6 minutes. During rinsing, the container is constantly shaken to remove the conductive glue, thereby separating the b...

Embodiment 2

[0026] Embodiment 2: A method for separating and recovering quartz crystal resonator wafers, such as figure 1 As shown, including the following steps:

[0027] (1) Put the quartz crystal resonator into a soaking solution for 3.5 to 5 hours. The soaking solution is made by adding TFD4, acetone and sodium hydroxide to plasma water and mixing. The volume ratio of TFD4, acetone and plasma water is 1:10:10, the material-to-liquid ratio of the sodium hydroxide to the plasma water is 7:10 g / ml; the TFD4 is produced by the French franklab company.

[0028] (2) Put the immersed quartz crystal resonator into a container filled with hot water at a temperature of 50°C to 70°C and rinse for 4 to 6 minutes, shaking the container continuously during rinsing;

[0029] (3) Put the quartz crystal resonator treated with hot water into a container filled with cold water for rinsing for 4-6 minutes. During rinsing, the container is constantly shaken to remove the conductive glue, thereby separating the ...

Embodiment 3

[0035] Embodiment 3: A method for separating and recovering quartz crystal resonator wafers, such as figure 1 As shown, including the following steps:

[0036] (1) Put the quartz crystal resonator into a soaking solution for 3.5 to 5 hours. The soaking solution is made by adding TFD4, acetone and sodium hydroxide to plasma water and mixing. The volume ratio of TFD4, acetone and plasma water is 1:12:8, the material-to-liquid ratio of the sodium hydroxide to the plasma water is 8:10 g / ml; the TFD4 is produced by the French franklab company.

[0037] (2) Put the immersed quartz crystal resonator into a container filled with hot water at a temperature of 50°C to 70°C and rinse for 4 to 6 minutes, shaking the container continuously during rinsing;

[0038] (3) Put the quartz crystal resonator treated with hot water into a container filled with cold water for rinsing for 4-6 minutes. During rinsing, the container is constantly shaken to remove the conductive glue, thereby separating the b...

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Abstract

The invention discloses a quartz crystal resonator wafer separation and recovery method, which includes the following steps: (1) Put the quartz crystal resonator into a soaking liquid and soak it for 3.5 to 5 hours. The soaking liquid uses TFD4, acetone and sodium hydroxide. Add plasma water to mix, (2) put the soaked quartz crystal resonator into a container filled with hot water and rinse for 4 to 6 minutes, shaking the container continuously during rinsing; the temperature of the hot water is 50°C to 70°C ℃; (3) Put the quartz crystal resonator treated with hot water into a container filled with cold water and rinse for 4 to 6 minutes. During rinsing, shake the container continuously to separate the base from the wafer. The invention can quickly and effectively peel off the wafer from the base, has high efficiency, low cost and simple operation, and can be widely used in the field of quartz crystal resonator wafer separation and recovery.

Description

Technical field [0001] The invention relates to the technical field of quartz crystal component manufacturing, in particular to a method for separating and recovering quartz crystal resonator wafers. Background technique [0002] The quartz crystal resonator needs to be glued to fix the quartz wafer on the base through conductive glue before being packaged, and then bake and solidify at a high temperature, and enter the fine-tuning project after the baking is completed. However, different defective products are produced in the glue dispensing and fine-tuning process, and these defective products are not caused by defective chips, but mainly caused by defective glue points, chip mounting status and other electrical characteristics. At present, the processing method for the defective products produced by the above dispensing and fine-tuning is directly scrapped, and the wafers cannot be well recycled. This processing method causes waste of materials and increases production costs. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L41/22H10N30/01
CPCH01L21/02
Inventor 金春建王文博程浩詹啸黄捷项奉南
Owner 黄山东晶电子有限公司
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