Programmable chipless electronic tag

Abstract

The invention relates to a programmable chipless electronic tag, which comprises a peripheral conductive region and a gap pattern located on the peripheral conductive region, wherein the peripheral conductive region is a metal conductive layer deposited on an insulating substrate; the gap pattern is composed of at least one strip-shaped window; and the strip-shaped window is filled with a phase change material capable of achieving resistance conversion. When an electrical signal is applied to the phase change material at the gap to cause a phase change, the material can be changed between a high-resistance state and a low-resistance state according to a Filament theory. Therefore, some gaps can be subjected to phase change through a programming method according to the coding requirements.Thus, the existence and disappearance of the gap can be freely controlled, so as to realize the programmable, reconstructed and infinite reuse of the electronic tag, which can greatly reduce the costto use under the premise of not increasing the difficulty of the process.

Description

technical field [0001] The invention relates to the technical field of radio frequency microwave circuits, in particular to a programmable chipless electronic label. Background technique [0002] At present, electronic tags have affected all aspects of military and civilian life, especially chipless electronic tags, which are passive tags. Because they do not contain integrated chips, they are low in cost and have a wide range of applications. They are considered to be one of the most potential electronic tags. . However, with the rapid development of Internet of Things technology, defects such as non-programmability and non-reusability of traditional electronic tags limit its large-scale application. Moreover, most chipless electronic tags are in the form of one-to-one correspondence, without programming functions, and cannot be reconfigured and reused. They cannot be reused, are not friendly to the ecological environment, and are not conducive to reducing production and u...

AI Technical Summary

Problems solved by technology

However, in this technology, the radio frequency electromagnetic signal is first converted into vibration through the piezoelectric substrate, then the vibration is converted into a sound signal, and then converted into an electromagnetic signal to be emitted. The whole device is not only complicated in process, but also includes a piezoelectric substrate, a transmitter Devices such as interdigital transducers and a set of distributed reflective grid arrays have the disadvantages of large size, high cost, and high power consumption, which lead to limited applications

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