Metal-clad laminated board, method for producing metal-clad laminated board, resin-attached metal member, method for producing resin-attached metal member, wiring board and method for producing wiring board
A metal-clad, laminated board technology, applied in the direction of metal layered products, metal pattern materials, chemical instruments and methods, etc.
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Examples
Embodiment 1
[0166] [Preparation of thermosetting resin composition]
[0167] Each component used when preparing a thermosetting resin composition in this Example is demonstrated.
[0168] (cyanate compound)
[0169] Cyanate compound: 2,2-bis(4-cyanophenyl)propane (BADCy manufactured by Lonza Japan Co., Ltd.)
[0170] (curing catalyst: organometallic salt)
[0171] ・Zinc octanoate (manufactured by DIC Corporation, zinc concentration 18% by mass)
[0172] (flame retardant: halogen flame retardant)
[0173] · SAYTEX8010: Ethylenebis(pentabromophenyl) (SAYTEX8010 manufactured by Albemarle Japan Corporation, melting point 350°C, incompatible halogen-based flame retardant dispersed in a thermosetting resin composition)
[0174] (filler: inorganic filler)
[0175] Inorganic filler (SC-2500-SEJ manufactured by Admatechs Company Limited, silica treated with an epoxysilane-type silane coupling agent)
[0176] [Preparation]
[0177] First, the solution of the obtained reaction product was hea...
Embodiment 2～9、 comparative example 1～7
[0181] For Examples 2 to 9 and Comparative Examples 1 to 7, the composition of the thermosetting resin composition, the metal layer, and the fibrous base material were changed to those shown in Table 1 and Table 2, respectively. 1 as well.
[0182] In addition, as the glass cloth which consists of NE glass, the #2116 type (NEA116, NE glass, thickness 0.1 mm) by Nitto Bosho Co., Ltd. was used.
[0183] In addition, as the metal layer 2 , a cobalt-plated copper foil (copper foil with a cobalt barrier layer, T9DA-SV [Rz: 1.0 μm, thickness 18 μm] manufactured by Fukuda Metal Foil Powder Co., Ltd.) was used.
[0184] In addition, as the metal layer 3 , a cobalt-plated copper foil (copper foil with a cobalt barrier layer, T9FZ-HS [Rz: 6.0 μm, thickness 18 μm] manufactured by Fukuda Metal Foil Powder Co., Ltd.) was used.
[0185] In addition, as the metal layer 4 , nickel-plated copper foil (copper foil with a nickel layer, T4X-SV [Rz: 1.1 μm, thickness 18 μm] manufactured by Fukuda...
Embodiment 10
[0187] Example 10 is a resin-coated metal member (resin-coated metal foil) that does not contain a fibrous base material in the insulating layer. Specifically, except that the insulating layer does not contain a fibrous base material, and the composition of the thermosetting resin composition and the metal layer are shown in Table 2, a metal member with resin was produced in the same manner as in Example 1. .
[0188] Each metal-clad laminate or resin-coated metal foil prepared as described above was evaluated by the method shown below. About the evaluation method of the metal foil with resin, it carried out by the same method except having used the metal foil with resin instead of a metal-clad laminate below. In addition, when gelling occurred at the time of manufacture of a reaction product and evaluation was impossible, "-" was shown in each evaluation.
[0189] [Dielectric properties (relative permittivity and dielectric loss tangent)]
[0190] The relative permittivity...
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Abstract
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