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Integrated MEMS transducers

A transducer and integrated circuit technology, applied in the field of integrated MEMS transducers, can solve the problems of large footprint, more space, and the limitation of the maximum number of dies.

Pending Publication Date: 2018-09-28
CIRRUS LOGIC INT SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The end result is that for base and cap wafers, the maximum number of dies per wafer will be limited because of the extra area required for MBW
Furthermore, the increased size of the MEMS transducer package 100c has the disadvantage of requiring more space in the host assembly, such as a larger footprint

Method used

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  • Integrated MEMS transducers
  • Integrated MEMS transducers
  • Integrated MEMS transducers

Examples

Experimental program
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Embodiment Construction

[0038] Embodiments of the invention relate to MEMS transducer devices, such as MEMS microphones. In some embodiments, the MEMS transducer device forms part of a MEMS transducer package, and may relate to a chip scale (CS) MEMS capacitive microphone package formed at wafer level. In some embodiments, a wafer level package (WLP) comprises: a substrate, such as a silicon substrate, that incorporates a MEMS capacitive microphone and its associated integrated electronic circuitry, such as for providing drive & readout circuitry; And a package lid or cap, such as a silicon cap, to protect the silicon base and provide a back volume for the microphone.

[0039] Some of the embodiments will be described below in the form of a wafer level package configured as a "bottom ported" package where the package is bonded to a next level interconnect (e.g., A "flip chip" bonded to another substrate or PCB within a host assembly such as a consumer product. However, it should be noted that the i...

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PUM

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Abstract

A MEMS transducer package (300) comprises a package cover (313) comprising a first bonding region (316) and an integrated circuit die (319) comprising a second bonding region (314) for bonding with the first bonding region of the package cover. The integrated circuit die (309) comprises an integrated MEMS transducer (31 1 ) and integrated electronic circuitry (312) in electrical connection with the integrated MEMS transducer. The footprint of the integrated electronic circuitry (312) at least overlaps the bonding region (314) of the integrated circuit die (309).

Description

[0001] The present application relates to methods and apparatus relating to integrated MEMS transducers, and in particular to arrangements for providing integrated MEMS transducers, such as MEMS microphones, formed on integrated circuit dies. Background technique [0002] Consumer electronic devices are gradually becoming smaller and gaining more and more performance and functionality as technology advances. This is evident in technologies used by consumer electronics and especially but not exclusively portable products such as mobile phones, audio players, video players, PDAs, wearable devices, mobile computing platforms, Devices such as laptops or tablets and / or gaming devices, or devices operable in an Internet of Things (loT) system or environment. Requirements from the mobile phone industry such as positive drive components are becoming smaller, more functional and less costly. Therefore, it is desirable to integrate the functions of electronic circuits and combine them ...

Claims

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Application Information

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IPC IPC(8): B81C1/00H04R19/04
CPCB81C1/00246B81C1/00309B81B2207/015B81B2207/096B81C2203/0109H01L2224/48137H01L2924/15151H04R2499/11H04R2499/15B81B2201/0257H04R19/005H04R19/04B81B7/0032B81C1/0023B81B7/0061B81B2203/0315B81B2207/012B81B2207/07H04R2201/003
Inventor T·胡克斯特拉
Owner CIRRUS LOGIC INT SEMICON