Method for fabricating flexible-rigid board by PP and protection tape

A soft-rigid combination board and protective tape technology, applied in the direction of multilayer circuit manufacturing, printed circuit manufacturing, printed circuit structural connection, etc. Guaranteed quality effect

Inactive Publication Date: 2018-10-02
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem of poor grinding of the existing rigid-flex boards after resin plugging holes, and provides a method for making rigid-flex boards with PP plus protective ta...

Method used

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Examples

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Embodiment

[0027] For boards with a line copper thickness equal to or greater than 3OZ, this embodiment provides a method for making a rigid-flex board with PP plus protective tape. The specific process is as follows:

[0028] (1) Cutting: According to the panel size of 520mm×620mm, the soft board core board and the hard board core board are cut out. The thickness of the soft board core board is 0.2mm, and the thickness of the outer copper foil is 1OZ. The board area and the soft-hard combination area; the thickness of the hard board core board is 0.7mm, and the thickness of the outer copper foil is 3OZ.

[0029] (2), inner layer circuit production (negative film process): inner layer graphics transfer, use vertical coating machine to coat photosensitive film, the film thickness of photosensitive film is controlled to 8μm, adopt automatic exposure machine, with 5-6 grid exposure ruler ( 21-grid exposure ruler) to complete the exposure of the inner layer circuit on the soft board core boa...

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PUM

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Abstract

The invention discloses a method for fabricating a flexible-rigid board by PP and a protection tape. The method comprises the following steps of respectively fabricating inner-layer circuits of a flexible core board and a rigid core board, wherein the flexible core board comprises a flexible board region and a flexible-rigid region; pasting a coverage film on the flexible board region on the flexible core board in an alignment way; pasting the protection tape on the coverage film; milling a blind groove around a part, corresponding to the flexible board region, on the rigid core board in a depth-controlled way, and reserving a certain residual thickness as a connection rib; laminating the flexible core board and the rigid core board by flowable glue PP to form a generation board, and forming a window in a position, corresponding to the flexible board region, on the flowable glue PP; sequentially fabricating an outer-layer circuit and a welding-resistant layer on the production board, and performing surface processing; and inwards milling a position, corresponding to the blind groove, on the production board to remove the connection rib, and fabricating the flexible-rigid board after uncovering. By employing the method, the flexible board region is effectively prevented from being bitten by a medicine and mechanically worn and scrapped, and an unfavorable risk of glue filling ofthe thick-copper flexible-rigid board is effectively prevented.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for producing a rigid-flex board with PP plus a protective tape. Background technique [0002] The rigid-flex board has both the characteristics of FPC and PCB. Therefore, it can be used in some products with special requirements. It has both a certain flexible area and a certain rigid area, which saves the internal space of the product and reduces the The volume of the finished product is of great help to improve the performance of the product. The existing method of making soft-rigid boards generally adopts the method of opening windows, that is, the part of the hard board corresponding to the soft board area is directly cut off and then pressed together, so that the soft board area will be exposed outside after pressing. In the following process, problems such as mechanical scratches and alkaline potion corrosion are likely to occur; and the ...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K3/36H05K1/14
CPCH05K3/4691H05K1/147H05K3/361
Inventor 彭卫红孙保玉许娟娟何淼翟青霞
Owner SHENZHEN SUNTAK MULTILAYER PCB
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