A semiconductor silicon wafer grinding system

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a semiconductor silicon wafer grinding system. The semiconductor silicon wafer grinding systemcomprises a supporting frame, an overturning motor, a driving shaft, a one-way brake, rotating discs, fixed discs, connecting rods, grinding devices, grinding sheets and a recovering box, and a brakerotating disc can achieve one-way rotation in center cylinder holes of the rotating discs; the rotating discs are connected fixedly through the two connecting rods, the rotating discs are arranged incenter cylinder holes of the fixed discs, and the end faces of one sides of the fixed disc are fixedly connected to a supporting plate of the supporting frame; and the grinding devices are arranged atthe middle portions of the connecting rods and are used for being matched with the grinding sheets to grind silicon wafer. According to the semiconductor silicon wafer grinding system, cams with different initial angles are arranged, and vibration of the grinding devices at the lower ends of the connecting rods is achieved; and balancing weights arranged at the middle portions of the connecting rods are transmitted, rotation of grinding discs in a fixed plane is achieved, and high-accuracy grinding of the surfaces of the wafers is achieved.

Description

Technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and specifically is a semiconductor silicon wafer polishing system. Background technique [0002] Wafer refers to silicon chips used in the production of silicon semiconductor integrated circuits. Wafers are carriers used to produce integrated circuits. In general, wafers refer to single crystal silicon wafers. Wafer is the most commonly used semiconductor material. According to its diameter, it is divided into specifications such as 4 inches, 5 inches, 6 inches, and 8 inches. Recently, 12 inches or even larger specifications have been developed. The larger the wafer, the more ICs that can be produced on the same wafer, which can reduce costs; however, there are higher requirements for material technology and production technology, such as uniformity and so on. In wafer manufacturing, with the upgrading of process technology and the shrinking of the size of wires and gates, photol...

AI Technical Summary

Problems solved by technology

However, the setting method of the grinding disc in this solution is inconvenient to clean the silicon wafer powder produced after grinding. The accumulation of silicon wafer powder in the grinding disc affects the processing accuracy of the silicon wafer; the vibration generated by the rotation of the grinding motor will be transmitted to the grinding disc , affecting the grinding accuracy of silicon wafers

Images