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Non-scaling-powder pulse ultrasound low-temperature brazing method for copper-based materials

A technology of pulsed ultrasonic and brazing method, which is applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of high pressure required for ultrasonic, high welding temperature, and industrialization of high-frequency data line welding.

Active Publication Date: 2018-10-19
东莞市新玛博创超声波科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The ultrasonic welding technology of the above-mentioned technologies has a common feature, that is, the ultrasonic solid-phase welding is used, the welding temperature is high, and the ultrasonic wave requires a large pressure.
The data cable connector has a special structure, and the internal plastic cannot withstand high temperature and high pressure. Usually, this defect will bring a fatal blow to the industrialization of high-frequency data cable welding.

Method used

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  • Non-scaling-powder pulse ultrasound low-temperature brazing method for copper-based materials
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  • Non-scaling-powder pulse ultrasound low-temperature brazing method for copper-based materials

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Effect test

Embodiment 1

[0149] A flux-free pulse ultrasonic low-temperature brazing method for copper-based materials, comprising the steps of:

[0150] Step S0: Ultrasonic solder dipping step, pre-impregnating the surface of the welding part of the copper-based base material with alloy solder by the ultrasonic solder dipping method, and then forming the assembly to be soldered;

[0151] Specifically, the ultrasonic brazing method is to immerse the welding part of the copper-based base metal in the alloy solder tank for 1 to 5 seconds and then remove the alloy solder tank, and at least during the soaking process, the liquid in the alloy solder tank Apply the second ultrasonic wave to the alloy solder or apply the second ultrasonic wave to the copper-based base material, and control the frequency of the second ultrasonic wave at 15-100KHz and the power at 100-500w, so that a layer of fine alloy is attached to the surface of the welding part Solder layer; preferably, the frequency of the second ultraso...

Embodiment 2

[0171] A flux-free pulse ultrasonic low-temperature brazing method for a copper wire and a circuit copper substrate, comprising the following steps:

[0172] Step S1 : stripping off the sheath, peeling off the sheath at the end of the copper wire, exposing the outer end of the copper wire to form a copper wire welding portion.

[0173] Specifically, an ultrasonic knife is used to strip the outer skin of the end of the copper wire; the sonoplastic effect of the ultrasonic wave is used to directly apply ultrasonic waves to the core stripping knife to improve bad phenomena such as mechanical knife stripping the core and breaking the copper wire.

[0174]Step S2: Ultrasonic brazing, immersing the soldered part of the copper wire and / or the copper circuit board in the alloy solder tank for 1 to 5 seconds before removing the alloy solder tank, and at least during the soaking process, the The second ultrasonic wave is applied to the liquid alloy solder, or the second ultrasonic wave ...

Embodiment 3

[0209] The present invention also provides a flux-free pulse ultrasonic low-temperature brazing method for copper wires and copper terminals in a high-frequency data line interface, which includes the following steps:

[0210] Step S1: stripping off the sheath, stripping off the outer sheath of each copper wire end in the high-frequency data line, so that the outer end of the copper wire is exposed to form a copper wire welding part;

[0211] Preferably, use an ultrasonic knife to peel off the sheath of each copper wire end in the high-frequency data line;

[0212] Step S2: Ultrasonic immersion brazing, immersing the soldered part of the copper wire and / or the copper terminal in the alloy solder tank for 1 to 5 seconds before removing the alloy solder tank, and at least during the soaking process, the Apply a second ultrasonic wave to the liquid alloy solder, or apply a second ultrasonic wave to the copper wire welding part and / or copper terminal, and control the frequency of ...

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Abstract

The invention discloses a non-scaling-powder pulse ultrasound low-temperature brazing method for copper-based materials. A to-be-welded assembly is composed of base metal and alloy brazing filler metal. The alloy brazing filler metal is formed by preparing at least two of SnAg, SnCu, SnIn or SnBi; pulse current is used for making an ultrasound tool head generate heat, the temperature of the ultrasound tool head is controlled to range from 200 DEG C to 400 DEG C, the brazing temperature ranges from 100 DEG C to 287 DEG C, and the welding face of the to-be-welded assembly is subjected to ultrasound brazing; and meanwhile, the ultrasonic action time ranges from 0.5 s to 6 s, and metallurgical bonding is formed by the welding base metal. According to the provided brazing method, the metallurgyreaction is generated between the base metal and the alloy brazing filler metal, metallurgical bonding is formed between the welding base metal and the alloy brazing filler metal, and the connectingstrength of an ultrasonic welding compression joint clamp is improved. On the basis of the forming principle, the invention further provides a non-scaling-powder pulse ultrasound low-temperature brazing method for a copper wire and a circuit copper base plate and a non-scaling-powder pulse ultrasound low-temperature brazing method for a copper wire and a copper terminal in a high-frequency data line interface.

Description

technical field [0001] The invention relates to the technical field of ultrasonic welding between copper and copper, in particular to a flux-free pulse ultrasonic low-temperature brazing method for copper-based materials, and in particular to a non-flux welding method for copper wires and terminals in a high-frequency data line interface. Flux pulse ultrasonic low temperature brazing method. Background technique [0002] Copper is the earliest metal used by human ancestors. It has many excellent characteristics and wonderful functions, and has made indelible contributions to the progress of human society; and with the development of human civilization, new uses have been continuously developed. Copper is not only an ancient metal, but also a modern engineering material full of vigor and vitality. At present, human beings have stepped into a colorful, highly civilized society characterized by electrification and electronic information, and the application of copper in data ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/06B23K1/20
CPCB23K1/0008B23K1/06B23K1/20
Inventor 赖志伟
Owner 东莞市新玛博创超声波科技有限公司
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