A treatment method for reducing warping of electrolytic copper foil

A treatment method, electrolytic copper foil technology, applied in electrolytic process, electroforming, metal material coating process, etc., can solve the problem of destroying crystal symmetry, achieve excellent oxidation resistance, realize warping, and increase anti-peeling strength Effect
CN108677225BActive Publication Date: 2020-05-08SHANDONG JINBAO ELECTRONICS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANDONG JINBAO ELECTRONICS
Publication Date
2020-05-08

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Abstract

The invention belongs to the technical field of copper foil treatment, and particularly relates to a treatment method for reducing warpage of an electrolytic copper foil. The method comprises acid washing, special coarsening, special curing, coarsening, curing, zinc-plated nickel alloy, anti-oxidation treatment, silane coupling agent treatment and drying. According to the treatment method for reducing warpage of the electrolytic copper foil, by special treatment on a rough surface of the copper foil, the surface pressure stress is increased, the stress on the two surfaces of the copper foil isfurther balanced, the residual stress of the copper foil is further reduced, and the warping degree of the copper foil is reduced; the electrolytic copper foil obtained by the treatment method, the rough surface is relatively large than the surface area, and the anti-stripping strength can be improved while the surface roughness is reduced; the electrolytic copper foil has excellent oxidation resistance, chemical resistance and etching resistance; and the treatment process is easy to control, and the product quality is stable.
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Description

technical field

[0001] The invention belongs to the technical field of copper foil treatment, and in particular relates to a treatment method for reducing warping of electrolytic copper foil. Background technique

[0002] Electrolytic copper foil is one of the basic materials for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCB), and is widely used in electronic products. With the development trend of light, thin, short and small electronic products, the consumer market demand for ultra-thin electrolytic copper foil is increasing, and the domestic production capacity of electrolytic copper foil with a thickness of 18 μm and below is expanding year by year. The production of ultra-thin electrolytic copper foil has extremely strict requirements on equipment, technology and environment, and a slight mistake in the link may easily cause product defects such as pinholes, warping, mottling, and porous cross-section.

[0003] Warpage is a common probl...

Claims

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