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Method for preparing middle frame, middle frame and electronic equipment

A technology of electronic equipment and metal outer frame, which is applied in the direction of electrical equipment shell/cabinet/drawer, electrical components, instruments, etc., can solve the problems of low processing efficiency and high cost

Active Publication Date: 2018-10-23
OPPO CHONGQING INTELLIGENT TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The current method of preparing the middle frame generally has the problems of low processing efficiency and high cost.

Method used

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  • Method for preparing middle frame, middle frame and electronic equipment
  • Method for preparing middle frame, middle frame and electronic equipment
  • Method for preparing middle frame, middle frame and electronic equipment

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Embodiment Construction

[0026] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0027] In one aspect of the present invention, the present invention provides a method for preparing a middle frame. This method improves the utilization rate of raw materials, reduces production costs, reduces processing time, and improves production efficiency; the solid connection between the middle frame plastic structure and the metal structure prepared by this method is tight and reliable, and can effectively resist vertical deformation. Shear force, and no need for laser welding to fix the shape, further reducing production costs....

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Abstract

The invention discloses a method for preparing a middle frame, the middle frame and electronic equipment. The method comprises the following steps: stamping a plane metal panel to form a groove in theedge of the plane metal panel; stretching the plane metal panel with the groove to form a metal outer frame, wherein the metal outer frame is provided with a bottom surface and an annular side framewhich is perpendicular to and surrounds the bottom surface, and the groove is formed in the side wall of the side, facing the bottom surface, of the annular side frame; and carrying out nano injectionmolding treatment on the metal outer frame and defining an accommodating space in the metal outer frame based on the groove to form a plastic structure so as to form the middle frame. Therefore, according to the method, the utilization ratio of raw materials is improved, the production cost is lowered, the processing time is shortened, and the production efficiency is improved.

Description

technical field [0001] The present invention relates to electronic equipment, in particular, to a method for preparing a middle frame, a middle frame and an electronic device. Background technique [0002] In the field of electronic equipment, with the trend of ultra-thin and large-screen, and the widespread use of 3D glass and ceramic cover plates, the requirements for the strength of the middle frame of electronic equipment are getting higher and higher. Therefore, in order to enhance the overall strength of electronic devices such as mobile terminals and improve user tactile experience, mobile terminals have adopted metal middle frames on a large scale. The metal middle frame has the advantages of anti-drop and corrosion resistance, and the side wall support part of the middle frame has a metal texture and appearance, which can be directly used as a side frame of a mobile phone, and has the advantages of delicate touch and wear resistance. [0003] However, the current m...

Claims

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Application Information

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IPC IPC(8): B29C45/14B21D28/02H05K5/02G09F9/00
CPCB21D28/02B29C45/1418B29C2045/14245G09F9/00H05K5/0217
Inventor 成蛟
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD
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