Semiconductor device and method of forming the same
A semiconductor and device technology, applied in the field of semiconductor devices and their formation, can solve problems such as poor performance of semiconductor devices, and achieve the effect of improving the current crowding effect
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[0032] As mentioned in the background, semiconductor devices formed in the prior art have poor performance.
[0033] figure 1 It is a schematic structural diagram of a semiconductor device, and the semiconductor device includes: a substrate 100 with an underlying metal layer 110 inside; a dielectric layer 120 located on the substrate 100; an interconnection layer opening penetrating through the dielectric layer 120, the The underlying metal layer 110 is exposed through the opening of the interconnection layer, and the opening of the interconnection layer includes a contact hole and a trench on the contact hole; the conductive layer 130 is located in the opening of the interconnection layer.
[0034] However, the electrical performance of the above-mentioned semiconductor devices is poor, and it is found through research that the reasons are:
[0035] The conductive layer 130 in the contact hole is used to electrically connect the underlying metal layer 110 with the conductive...
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