Contact photolithography machine for semiconductor chip production
A contact and semiconductor technology, applied in the field of lithography machine, can solve the problems of unstable fixation and poor shock absorption effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0020] see Figure 1-5 , the present invention provides a technical solution: a contact photolithography machine for semiconductor chip production, including a base plate 1, a first fixed shaft 2, a first movable shaft 3, a limiting plate 4, a first guide rod 5, a first movable shaft Rod 6, limiting block 7, fixing screw 8, body 9, clamping plate 10, clamping groove 11, dovetail block 12, dovetail groove 13, second movable rod 14, second guide rod 15, spring 1...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


