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Contact photolithography machine for semiconductor chip production

A contact and semiconductor technology, applied in the field of lithography machine, can solve the problems of unstable fixation and poor shock absorption effect

Active Publication Date: 2021-03-23
JIANGSU ETERN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a contact photolithography machine for semiconductor chip production, to solve the shortcomings of the existing contact photolithography machine for semiconductor chip production proposed in the above background technology, such as insufficient fixation and poor shock absorption effect. question

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  • Contact photolithography machine for semiconductor chip production
  • Contact photolithography machine for semiconductor chip production
  • Contact photolithography machine for semiconductor chip production

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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] see Figure 1-5 , the present invention provides a technical solution: a contact photolithography machine for semiconductor chip production, including a base plate 1, a first fixed shaft 2, a first movable shaft 3, a limiting plate 4, a first guide rod 5, a first movable shaft Rod 6, limiting block 7, fixing screw 8, body 9, clamping plate 10, clamping groove 11, dovetail block 12, dovetail groove 13, second movable rod 14, second guide rod 15, spring 1...

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Abstract

The invention discloses a contact lithography machine for semiconductor chip production, which comprises a bottom plate, limiting plates and a clamping plate. A first fixed shaft is fixedly mounted inthe middle of the upper part of the bottom plate, a first movable shaft is arranged at the upper part of the first fixed shaft, and a layer plate is arranged at the upper part of the first movable shaft; first movable rods are arranged at one side of the lower part of the layer plate, first guide rods are arranged at the lower parts of the first movable rods, and a body is movably mounted above the layer plate; the limiting plates are arranged at one side of the upper end of the bottom plate; limiting blocks are arranged at the edge sides of the upper parts of the bottom plates, and fixed screws run through the insides of the limiting blocks; clamping grooves are reserved at one sides of the limiting plates, and dovetail blocks are arranged below the limiting plates; dovetail grooves arereserved at the upper end of the bottom plate; second movable rods are arranged in the middle of the upper part of the layer plate, second guide rods are arranged above the second movable rods, and the outer ends of the second movable rods are coated with springs. The contact lithography machine for semiconductor chip production has effects of fixing, stabilizing and damping.

Description

technical field [0001] The invention relates to the technical field of lithography machines, in particular to a contact lithography machine for semiconductor chip production. Background technique [0002] Lithography machine is also known as mask alignment exposure machine, exposure system and lithography system. Spin-coating photoresist, soft baking, alignment exposure, post-baking, development, hard baking, and etching processes. The photolithography machine is a machine that uses light to make a pattern, uniform glue on the surface of the silicon wafer, and then place the mask The process of transferring the pattern on the photoresist to temporarily "copy" the device or circuit structure to the silicon wafer is the working process of the lithography machine. The contact lithography machine for semiconductor chip production needs to be fixed and suitable for different environments. shock absorption, [0003] The existing contact lithography machine for semiconductor chip...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/20G03F7/70808
Inventor 梁亚
Owner JIANGSU ETERN