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X-band active array sub-array structure

An array and sub-array technology, applied in the field of X-band active array sub-array structure, can solve the problems such as the inability to meet the requirements of vehicle folding and thinning, complex feed synthesis, thick array thickness, etc., and achieve compact structure, simplified external interface and structure. independent effects

Pending Publication Date: 2018-11-06
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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AI Technical Summary

Problems solved by technology

[0003] In order to meet the requirements of ultra-high power, the total power needs to be divided into distributed. However, in the usual distributed combined power method, if the unit spacing is selected according to the aperture of the conventional antenna array element, the number of components is large, the feed combination is complicated, and the cost is very high; If the structural form is combined according to the conventional brick-type array, the thickness of the array is relatively thick, which cannot meet the light and thin requirements of vehicle-mounted folding

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Embodiment Construction

[0023] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0024] An X-band active array sub-array structure, which includes an antenna layer, a component layer, a cold plate and an auxiliary layer arranged in sequence from top to bottom, and the antenna layer is composed of 16 optimized ports arranged in a 4×4 rectangular array The antenna unit is composed of a surface antenna unit, the antenna unit is a patch antenna with a laminated printed board structure, the component layer is composed of 4 unit components arranged in a 2×2 rectangular array, and the top of each unit component is just set Four antenna units, the antenna unit and the unit assembly and between the unit assembly and the cold plate are fixedly connected by screws, and the antenna unit and the unit assembly are connected by a radio frequency connector The cold plate is provided with a cold liquid channel, the cold plate is a...

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Abstract

The invention discloses an X-band active array sub-array structure, and relates to the technical field of electronic countermeasure. The X-band active array sub-array structure comprises an antenna layer, a module layer, a cold plate and an auxiliary layer, wherein the antenna layer comprises sixteen optimized aperture antenna units which are arranged a mode of four by four rectangular arrays, themodule layer comprises four unit assemblies in a mode of two by two rectangular arrays, a cold liquid passage is arranged in the cold plate, via holes are further formed in the cold plate, the auxiliary layer comprises an auxiliary module fixedly arranged on a bottom surface of the cold plate, and the unit assemblies are connected with a circularly-circulated device and a power control module bya feeder penetrating through the via holes. The X-band active array sub-array structure has the characteristics of structure independence and function independence, flexible block-type building can beachieved, modular splicing is facilitated, and the X-band active array sub-array structure is suitably used for large-size equipment with overlarge power and low cost.

Description

technical field [0001] The invention relates to the technical field of electronic countermeasures, in particular to an X-band active array sub-array structure. Background technique [0002] The most effective way of comprehensive countermeasures is to have a power advantage. High-power technology is an indispensable basic support technology for cross-beam countermeasures. Solid-state high-power has the characteristics of continuous and effective continuous wave, which is the technical basis of high-power arrays. [0003] In order to meet the requirements of ultra-high power, the total power needs to be divided into distributed ones. However, in the usual distributed combined power method, if the element spacing is selected according to the aperture of the conventional antenna element, the number of components is large, the feed combination is complicated, and the cost is very high; If the structural form is combined according to the conventional brick array, the thickness of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/02H01Q1/38H01Q1/42H01Q1/50H01Q21/00
CPCH01Q1/02H01Q1/38H01Q1/42H01Q1/50H01Q21/00
Inventor 朱海波
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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