Printed circuit board laminating cushion and preparation method thereof

A printed circuit board and buffer pad technology is applied in the field of a printed circuit board lamination buffer pad and its preparation, which can solve the problems of prolonging the printing circuit board preparation process time, decreasing product output, reducing production efficiency, etc., and saving heating time. and lamination process time, increase productivity, and increase service life

Inactive Publication Date: 2018-11-13

昆山市柳鑫电子有限公司

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AI-Extracted Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a printed circuit board lamination buffer pad and its preparation method, aiming at solving the problem of exten...

Method used

In summary, a kind of cushion pad for printed circuit board lamination provided by the present invention and preparation method thereof, the cushion pad for printed circuit board lamination of the present invention comprises successively from bottom to top: high temperature resistant adhesive layer, Felt pad and high temperature resistant adhesive layer; the high temperature resistant adhesive layer is prepared by impregnating or coating high temperature resistant adhesive on one side with cloth or paper prepared from fibers with a decomposition temperature above 300°C; the felt The pad includes: two outer layers are aramid fiber tulle, a laminated high thermal conductivity fiber tulle between the two outer layers, and a base cloth between adjacent two layers of tulle; the high thermal conductivity fiber It is a fiber with thermal conductivity above 25W/(m.K). The weaving structure of the felt pad of the present invention makes the internal structure of the cushion pad have a structure similar to that of an air cushion, which has a certain buffering effect on the pressure exerted by the pre...

Abstract

The invention discloses a printed circuit board laminating cushion and a preparation method thereof. The cushion comprises a high temperature-resistant adhesive layer, a felt pad and a high temperature resistant adhesive layer in sequence from bottom to top, wherein the felt pad comprises two outer layers of aramid fiber gauze, multiple layers of high-heat-conducting fiber gauze between the two outer layers, and base fabrics between each two adjacent layers of a gauze; or, the felt pad comprises multiple layers of mixed gauze formed by interweaving aramid fibers and high-heat-conducting fibers, and base fabrics between each two adjacent layers of mixed gauze. The woven structure of the felt pad makes the internal structure of the cushion have a structure similar to that of an air cushion,so that the cushion has a certain buffering effect on pressure applied by a press; by adding the high-heat-conducting fiber, the heat conductivity of the cushion is improved, the heat conduction is accelerated, the lamination process time is saved, the productivity is improved, and the production cost is reduced.

Application Domain

Synthetic resin layered productsLamination +2

Technology Topic

Production ratePrinted circuit board +5

Image

Examples

Experimental program(4)

Example Embodiment

[0052] Example 1

[0053] The preparation method of the buffer pad for printed circuit board lamination in this embodiment includes the following steps:

[0054] a. Weave aramid fiber 1414 and graphene fiber into tulle separately; then according to the two outer layers are aramid fiber 1414 tulle, between the two outer layers are graphene fiber tulle and aramid fiber in order from bottom to top 1414 gauze, graphene fiber gauze, and two adjacent layers of gauze are laminated with an aramid 1414 base fabric; the above-mentioned laminates are placed in a needle punching machine and needle punched into a felt pad. The felt pad contains four layers of aramid fiber 1414 base fabric, three layers of aramid fiber 1414 gauze and two layers of graphene fiber gauze.

[0055] b. Place the PTFE glass fiber viscose on the upper and lower surfaces of the felt pad. Under the conditions of a temperature of 150°C, a vehicle speed of 20m/min, and a pressure of 6Mpa, a high thermal conductivity cushioning pad is prepared.

[0056] The longitudinal cross-sectional view of the high thermal conductivity cushion is as figure 1 As shown, 101 is PTFE glass fiber viscose cloth, 102 is aramid fiber 1414 gauze, 103 is aramid 1414 base cloth, and 104 is graphene fiber gauze.

Example Embodiment

[0057] Example 2

[0058] The preparation method of the buffer pad for printed circuit board lamination in this embodiment includes the following steps:

[0059] a. Weave aramid fiber 1414 and silicon nitride fiber into tulle respectively; then according to the two outer layers are aramid fiber 1414 tulle, between the two outer layers are silicon nitride fiber tulle and aromatic Aramid fiber 1414 gauze, silicon nitride fiber gauze, and two adjacent layers of gauze are laminated with an aramid 1414 base fabric; the above-mentioned laminate is placed in a needle punching machine and needled into a felt pad. The felt contains four layers of aramid 1414 base fabric, three layers of aramid fiber 1414 gauze and two layers of silicon nitride fiber gauze.

[0060] b. Place the PTFE glass fiber viscose on the upper and lower surfaces of the felt pad. Under the conditions of a temperature of 150°C, a vehicle speed of 20m/min, and a pressure of 6Mpa, a high thermal conductivity cushioning pad is prepared.

Example Embodiment

[0061] Example 3

[0062] The preparation method of the buffer pad for printed circuit board lamination in this embodiment includes the following steps:

[0063] a. Fully mix aramid fiber 1414 and silicon nitride fiber at a weight ratio of 3:1 to woven into a mixed tulle; then place 4 layers of the above mixed tulle from bottom to top, and between the two adjacent layers of tulle The middle is the lamination method of aramid 1414 base cloth; the above lamination is placed in a needle punching machine and needle punched into a felt pad. The felt contains three layers of aramid fiber 1414 base fabric, four layers of aramid fiber 1414 and silicon nitride fiber mixed tulle.

[0064] b. Place the PTFE glass fiber viscose on the upper and lower surfaces of the felt pad, and make a high thermal conductivity cushion under the conditions of a temperature of 160°C, a speed of 20m/min, and a pressure of 5Mpa.

[0065] The longitudinal cross-sectional view of the high thermal conductivity cushion is as figure 2 As shown, 201 is a PTFE glass fiber viscose cloth, 202 is a hybrid gauze, and 203 is an aramid 1414 base cloth.

PUM

Property	Measurement	Unit
Thermal conductivity	>= 25.0	W/K/m
Length	3.0 ~ 500.0	mm
Temperature range	200.0 ~ 350.0	°C

Description & Claims & Application Information

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Printed circuit board laminating cushion and preparation method thereof

AI-Extracted Technical Summary

Problems solved by technology

Method used

Abstract

Image

Examples

Example Embodiment

Example Embodiment

Example Embodiment

PUM

Description & Claims & Application Information

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