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Printed circuit board laminating cushion and preparation method thereof

A printed circuit board and buffer pad technology is applied in the field of a printed circuit board lamination buffer pad and its preparation, which can solve the problems of prolonging the printing circuit board preparation process time, decreasing product output, reducing production efficiency, etc., and saving heating time. and lamination process time, increase productivity, and increase service life

Inactive Publication Date: 2018-11-13
昆山市柳鑫电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a printed circuit board lamination buffer pad and its preparation method, aiming at solving the problem of extending the printed circuit board caused by the slow heat conduction of the existing organic polymer fiber buffer pads. The preparation process time is reduced, the production efficiency is reduced, and the product output is reduced.

Method used

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  • Printed circuit board laminating cushion and preparation method thereof
  • Printed circuit board laminating cushion and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] The preparation method of the printed circuit board lamination buffer pad described in the present embodiment comprises the following steps:

[0054] a. Weave aramid fiber 1414 and graphene fiber into tulle respectively; then the two outer layers are aramid fiber 1414 tulle, and the two outer layers are graphene fiber tulle and aramid fiber from bottom to top. 1414 tulle, graphene fiber tulle, and aramid 1414 base cloth between two adjacent layers of tulle are laminated; the above laminate is placed in a needle punching machine and needled into a felt pad. The felt pad includes four layers of aramid fiber 1414 base cloth, three layers of aramid fiber 1414 tulle and two layers of graphene fiber tulle.

[0055] b. Arrange PTFE glass fiber glue on the upper and lower surfaces of the felt pad, and make a high thermal conductivity cushion under the conditions of temperature of 150°C, vehicle speed of 20m / min, and pressure of 6Mpa.

[0056] The longitudinal section view of t...

Embodiment 2

[0058] The preparation method of the printed circuit board lamination buffer pad described in the present embodiment comprises the following steps:

[0059] a. Weave aramid fiber 1414 and silicon nitride fiber into tulle respectively; then the two outer layers are aramid fiber 1414 tulle, and the two outer layers are silicon nitride fiber tulle and aramid fiber tulle from bottom to top. Lamination of 1414 rayon fiber tulle, silicon nitride fiber tulle, and aramid 1414 base cloth between two adjacent layers of tulle; the above lamination is placed in a needle punching machine to form a felt pad. The felt consists of four layers of aramid 1414 base fabric, three layers of aramid fiber 1414 tulle and two layers of silicon nitride fiber tulle.

[0060] b. Arrange PTFE glass fiber glue on the upper and lower surfaces of the felt pad, and make a high thermal conductivity cushion under the conditions of temperature of 150°C, vehicle speed of 20m / min, and pressure of 6Mpa.

Embodiment 3

[0062] The preparation method of the printed circuit board lamination buffer pad described in the present embodiment comprises the following steps:

[0063] a. Fully mix aramid fiber 1414 and silicon nitride fiber in a weight ratio of 3:1, and weave a mixed tulle; The middle is the lamination method of aramid fiber 1414 base cloth; the above lamination is placed in a needle punching machine and needled into a felt pad. The felt consists of three layers of aramid 1414 base fabric, four layers of aramid fiber 1414 and silicon nitride fiber mixed tulle.

[0064] b. Arrange PTFE glass fiber glue on the upper and lower surfaces of the felt pad, and make a high thermal conductivity cushion under the conditions of temperature of 160°C, vehicle speed of 20m / min, and pressure of 5Mpa.

[0065] The longitudinal sectional view of the high thermal conductivity buffer pad is as follows: figure 2 As shown, 201 is PTFE fiberglass viscose cloth, 202 is mixed tulle, and 203 is aramid 1414 b...

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Abstract

The invention discloses a printed circuit board laminating cushion and a preparation method thereof. The cushion comprises a high temperature-resistant adhesive layer, a felt pad and a high temperature resistant adhesive layer in sequence from bottom to top, wherein the felt pad comprises two outer layers of aramid fiber gauze, multiple layers of high-heat-conducting fiber gauze between the two outer layers, and base fabrics between each two adjacent layers of a gauze; or, the felt pad comprises multiple layers of mixed gauze formed by interweaving aramid fibers and high-heat-conducting fibers, and base fabrics between each two adjacent layers of mixed gauze. The woven structure of the felt pad makes the internal structure of the cushion have a structure similar to that of an air cushion,so that the cushion has a certain buffering effect on pressure applied by a press; by adding the high-heat-conducting fiber, the heat conductivity of the cushion is improved, the heat conduction is accelerated, the lamination process time is saved, the productivity is improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of printed circuit board lamination, in particular to a buffer pad for printed circuit board lamination and a preparation method thereof. Background technique [0002] The known method of laminating printed circuit boards is to first put a buffer pad on the carrier plate, then put steel plates, blanks, and steel plates in sequence, and stack the blanks and steel plates in multiple layers (the number of layers of multi-layer stacking depends on the thickness of the printed circuit board. , substrate material, lamination time, lamination temperature, pressure to choose, generally 4-8 layers of steel plate), then place the buffer pad, and then put the multi-layer laminated products (steel plate, blank material, steel plate, blank material, Steel plate...), there should be a buffer pad between the multi-layer laminates, and finally the buffer pad and the carrier plate cover (generally 3-5 multi-layer laminates w...

Claims

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Application Information

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IPC IPC(8): B32B7/12B32B9/00B32B9/04B32B17/02B32B17/10B32B27/02B32B27/08B32B27/12B32B27/30B32B27/34B32B37/06B32B37/12
CPCB32B5/02B32B5/26B32B7/12B32B27/08B32B27/12B32B27/304B32B27/34B32B37/06B32B37/1284B32B2037/1215B32B2262/0238B32B2262/101B32B2262/106
Inventor 杜山山罗小阳张伦强杨迪张德库
Owner 昆山市柳鑫电子有限公司
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