Printed circuit board laminating cushion and preparation method thereof
A printed circuit board and buffer pad technology is applied in the field of a printed circuit board lamination buffer pad and its preparation, which can solve the problems of prolonging the printing circuit board preparation process time, decreasing product output, reducing production efficiency, etc., and saving heating time. and lamination process time, increase productivity, and increase service life
Inactive Publication Date: 2018-11-13
昆山市柳鑫电子有限公司
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Abstract
The invention discloses a printed circuit board laminating cushion and a preparation method thereof. The cushion comprises a high temperature-resistant adhesive layer, a felt pad and a high temperature resistant adhesive layer in sequence from bottom to top, wherein the felt pad comprises two outer layers of aramid fiber gauze, multiple layers of high-heat-conducting fiber gauze between the two outer layers, and base fabrics between each two adjacent layers of a gauze; or, the felt pad comprises multiple layers of mixed gauze formed by interweaving aramid fibers and high-heat-conducting fibers, and base fabrics between each two adjacent layers of mixed gauze. The woven structure of the felt pad makes the internal structure of the cushion have a structure similar to that of an air cushion,so that the cushion has a certain buffering effect on pressure applied by a press; by adding the high-heat-conducting fiber, the heat conductivity of the cushion is improved, the heat conduction is accelerated, the lamination process time is saved, the productivity is improved, and the production cost is reduced.
Application Domain
Synthetic resin layered productsLamination +2
Technology Topic
Production ratePrinted circuit board +5
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PUM
Property | Measurement | Unit |
Thermal conductivity | >= 25.0 | W/K/m |
Length | 3.0 ~ 500.0 | mm |
Temperature range | 200.0 ~ 350.0 | °C |
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