Device for strengthening rapid separation of bubbles on boiling surface and manufacturing method of device

Abstract

The invention discloses a device for strengthening rapid separation of bubbles on a boiling surface and a manufacturing method of the device. The device comprises a base table, and a strengthening boiling heat exchange structure is arranged in the middle of the base table; the outer edge of the base table is connected with a condenser through a plurality of distance adjusting studs, and the condenser is located right above the strengthening boiling heat exchange structure; a plurality of run-through air channel channels are formed in the upper surface of the condenser, and a bubble auxiliary separating structure is arranged on the lower surface of the condenser; a plurality of run-through cooling working medium channels are arranged in the side surface of the condenser; and the outer surfaces of the condenser and the bubble auxiliary separation structure are hydrophobic surfaces, and the inner wall of the air channel is a hydrophilic surface. According to the invention, the separationsize of the bubbles can be reduced, the bubbles can be driven to be quickly separated, and the aggregation of the bubbles can be avoided, meanwhile, the liquid supplementing capability is enhanced, and the boiling heat transfer coefficient and the critical heat flux density can be remarkably improved.

Description

technical field [0001] The invention relates to an ultra-high heat flux boiling enhanced heat transfer technology, in particular to a high-efficiency cooling technology suitable for an ultra-high heat flux electronic chip, in particular to a device for enhancing the rapid detachment of bubbles on the boiling surface and a manufacturing method thereof. Background technique [0002] With the development of MEMS (Micro-Electro-Mechanical-Systems) technology, the degree of integration and high frequency of electronic devices is increasing day by day, while the size is continuously reduced, the thermal power is getting higher and higher, so the heat flux density of electronic components is getting higher and higher. The higher the value, the heat dissipation problem becomes the main constraint factor affecting the performance and life of electronic devices. The manufacture, use and development of electronic components are inseparable from their heat dissipation capabilities. The...

AI Technical Summary

Problems solved by technology

However, in the high heat flux area, a large number of bubbles aggregate and easily form film boiling, which leads to the deterioration of the heat transfer process.

When the connectivity between the surface microstructures is weak, it is easy to make it difficult to refill the heat exchange process, and it is also easy to form film boiling

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