Composite cover plate and preparation method thereof
A composite board and cover board technology, applied in electrical equipment shell/cabinet/drawer, electrical components, chassis/box/cabinet/drawer parts, etc., can solve the problems of single, poor thermal conductivity, easy deformation function, etc. Large space, enhanced thermal conductivity, reduced size effect
Pending Publication Date: 2018-11-23
VITALNK IND SHENZHEN +1
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Abstract
The invention relates to a composite cover plate and a preparation method thereof. The composite cover plate comprises a substrate, a hardening layer and a functional layer, wherein the substrate is provided with a first surface and a second surface which are opposite to each other, the hardening layer covers the first surface, and the functional layer comprises a conductive layer and a protectivelayer covering the conductive layer. The conductive layer is provided with an etching channel, and the conductive layer covers the second surface. According to the composite cover plate, the hardnessof the composite cover plate can be improved by the hardening layer, and the composite cover plate can also have color decoration effects such as dazzle color, metal color and the like. The functional layer comprises a conductive layer and a protective layer, and the conductive layer is provided with an etching channel which can enable the conductive layer to obtain a required circuit. The heat conduction performance of the composite cover plate is enhanced, so that the composite cover plate is also embedded with a circuit system while the protection function is achieved. Part of the circuitof an electronic product can be transferred to the composite cover plate, and the size of a circuit board is reduced, and larger space is provided for other parts of an electronic product.
Application Domain
Casings/cabinets/drawers details
Technology Topic
HardnessMetal +1
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- Experimental program(4)
- Effect test(2)
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PUM
Property | Measurement | Unit |
Nanohardness | 1.0 ~ 15.0 | GPa |
Bending stress | 85.0 ~ 438.0 | mPa |
Thermal conductivity | 3.5 ~ 6.7 | W/k/m |
Description & Claims & Application Information
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