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Composite cover plate and preparation method thereof

A composite board and cover board technology, applied in electrical equipment shell/cabinet/drawer, electrical components, chassis/box/cabinet/drawer parts, etc., can solve the problems of single, poor thermal conductivity, easy deformation function, etc. Large space, enhanced thermal conductivity, reduced size effect

Pending Publication Date: 2018-11-23
VITALNK IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a composite cover with high hardness, good thermal conductivity and multi-function and its preparation method for the problems of poor thermal conductivity, easy deformation and single function of the plastic cover.

Method used

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  • Composite cover plate and preparation method thereof
  • Composite cover plate and preparation method thereof
  • Composite cover plate and preparation method thereof

Examples

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preparation example Construction

[0044] This embodiment also relates to a method for preparing a composite cover plate, comprising the following steps:

[0045] 1) Coating inorganic oxide, alkaline earth metal nitride, alkaline earth metal oxynitride, transition metal nitride, alkaline earth metal oxynitride, organic silicon or fluoride on the first surface of the substrate to form a hardened layer.

[0046] After the hardened layer is formed by coating, the hardness of the composite cover can be increased from 1H to 4H-5H.

[0047] In a specific example, the coating of inorganic oxides, alkaline earth metal nitrides, alkaline earth metal oxynitrides, transition metal nitrides, and alkaline earth metal oxynitrides on the first surface of the substrate is accomplished by vacuum coating. The silicone or fluoride is coated on the first surface of the substrate by means of spray coating or flow coating.

[0048] In a specific example, the hardened layer is a hard coating.

[0049] In a specific example, the mat...

Embodiment 1

[0064] The preparation method of the composite cover plate of the present embodiment is:

[0065] 1) Plating copper on the second surface of the substrate by electroplating, and then etching the copper plating layer by printing and etching ink to obtain a conductive layer;

[0066] 2) Print insulating material on the conductive layer to obtain a protective layer;

[0067] 3) performing surface treatment on the first surface of the substrate;

[0068] 4) spraying PMMA on the first surface of the substrate to obtain an adhesive layer;

[0069] 5) Spray silicone on the adhesive layer to form a 6 μm hardened layer;

[0070] 6) Carry out CNC processing and cleaning to obtain a composite cover plate (see attached figure 1 ).

Embodiment 2

[0072] The preparation method of the composite cover plate of the present embodiment is:

[0073] 1) Plating copper on the second surface of the substrate by electroplating, and then etching the copper plating layer by printing and etching ink to obtain the first conductive layer;

[0074] 2) printing an insulating material on the first conductive layer to obtain a first protective layer;

[0075] 3) Continue copper plating on the first protective layer, and then etch the copper plating layer to generate an etching path to obtain a second conductive layer;

[0076] 4) printing an insulating material on the second conductive layer to obtain a second protective layer;

[0077] 5) performing surface treatment on the first surface of the substrate;

[0078] 6) Vacuum sputtering coating is carried out on the first surface of the substrate, and the coating material is SiO 2 、Si 3 N 4 、Si 2 N 2 A mixture of O to form a hardened layer of 0.8 μm;

[0079] 7) Spray an anti-finge...

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Abstract

The invention relates to a composite cover plate and a preparation method thereof. The composite cover plate comprises a substrate, a hardening layer and a functional layer, wherein the substrate is provided with a first surface and a second surface which are opposite to each other, the hardening layer covers the first surface, and the functional layer comprises a conductive layer and a protectivelayer covering the conductive layer. The conductive layer is provided with an etching channel, and the conductive layer covers the second surface. According to the composite cover plate, the hardnessof the composite cover plate can be improved by the hardening layer, and the composite cover plate can also have color decoration effects such as dazzle color, metal color and the like. The functional layer comprises a conductive layer and a protective layer, and the conductive layer is provided with an etching channel which can enable the conductive layer to obtain a required circuit. The heat conduction performance of the composite cover plate is enhanced, so that the composite cover plate is also embedded with a circuit system while the protection function is achieved. Part of the circuitof an electronic product can be transferred to the composite cover plate, and the size of a circuit board is reduced, and larger space is provided for other parts of an electronic product.

Description

technical field [0001] The invention relates to the technical field of electronic products, in particular to a composite cover plate and a preparation method thereof. Background technique [0002] With the continuous development of the electronic information industry, more and more electronic products have emerged on the market. The surface of electronic products is generally equipped with a protective cover to protect the internal structure of the electronic product. Among them, the plastic cover has attracted more and more attention due to its low cost and easy processing; but the plastic cover also has poor thermal conductivity, Disadvantages such as easy deformation lead to poor protection for battery parts, which limits the application of plastic cover plates. In addition, the current plastic cover has a single function and usually only plays a protective role. Contents of the invention [0003] Based on this, it is necessary to provide a composite cover with high h...

Claims

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Application Information

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IPC IPC(8): H05K5/02
CPCH05K5/0243H05K5/0247
Inventor 王伟许仁李可峰
Owner VITALNK IND SHENZHEN
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