Composite cover plate and preparation method thereof

A composite board and cover board technology, applied in electrical equipment shell/cabinet/drawer, electrical components, chassis/box/cabinet/drawer parts, etc., can solve the problems of single, poor thermal conductivity, easy deformation function, etc. Large space, enhanced thermal conductivity, reduced size effect

Pending Publication Date: 2018-11-23

VITALNK IND SHENZHEN +1

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AI-Extracted Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a composite cover with high hardness, good thermal conductivity and multi-function ...

Method used

Above-mentioned composite cover plate 10, by being covered with hardened layer 130 on the first surface 110 of substrate 100, hardened layer 130 can improve the hardness of composite cover plate 10, can also make composite cover plate 10 have dazzling color, metal Color and other color decorative effects. The second surface 120 of the substrate 100 is covered with a functional layer 140, the functional layer 140 includes a conductive layer 141 and a protective layer 142, the conductive layer 141 has an etching path, the etching path can enable the conductive layer 141 to obtain the desired circuit, this setting enhances the composite The thermal conductivity of the cover 10 makes the composite cover 10 not only have a protective function, but also embed a circuit system, which can transfer part of the circuit of the electronic product to the composite cover, reduce the size of the circuit board, and provide protection for the electronic product. Other parts provide more space.

[0033] In a specif...

Abstract

The invention relates to a composite cover plate and a preparation method thereof. The composite cover plate comprises a substrate, a hardening layer and a functional layer, wherein the substrate is provided with a first surface and a second surface which are opposite to each other, the hardening layer covers the first surface, and the functional layer comprises a conductive layer and a protectivelayer covering the conductive layer. The conductive layer is provided with an etching channel, and the conductive layer covers the second surface. According to the composite cover plate, the hardnessof the composite cover plate can be improved by the hardening layer, and the composite cover plate can also have color decoration effects such as dazzle color, metal color and the like. The functional layer comprises a conductive layer and a protective layer, and the conductive layer is provided with an etching channel which can enable the conductive layer to obtain a required circuit. The heat conduction performance of the composite cover plate is enhanced, so that the composite cover plate is also embedded with a circuit system while the protection function is achieved. Part of the circuitof an electronic product can be transferred to the composite cover plate, and the size of a circuit board is reduced, and larger space is provided for other parts of an electronic product.

Application Domain

Casings/cabinets/drawers details

Technology Topic

HardnessMetal +1

Image

Examples

Experimental program(4)
Effect test(2)

Example Embodiment

[0044] This embodiment also relates to a method for preparing a composite cover plate, including the following steps:

[0045] 1) Coating the first surface of the substrate with inorganic oxide, alkaline earth metal nitride, alkaline earth metal oxynitride, transition metal nitride, alkaline earth metal oxynitride, organic silicon or fluoride to form a hardened layer.

[0046] After the hardened layer is formed by coating, the hardness of the composite cover can be increased from 1H to 4H~5H.

[0047] In a specific example, the coating of inorganic oxides, alkaline earth metal nitrides, alkaline earth metal oxynitrides, transition metal nitrides, and alkaline earth metal oxynitrides on the first surface of the substrate is completed by vacuum coating. The organic silicon or fluoride is coated on the first surface of the substrate by spraying or curtain coating.

[0048] In a specific example, the hardened layer is a hard plating layer.

[0049] In a specific example, the material of the hardened layer is selected from SiO 2 , TiO 2 , Al 2 O 3 , Nb 2 O 5 , Si 3 N 4 , Si 2 N 2 O, AlON, SiAlON, TiN, CrN, TiC, CrC and Ta 2 O 5 At least one of them.

[0050] Preferably, the material of the hardened layer is selected from Si 3 N 4 , At least one of Si2N2O, AlON and SiAlON; from Si 3 N 4 The hardened layer prepared by at least one of Si2N2O, AlON and SiAlON has the effects of brightening, dazzling, and hardening. Nano hardness can reach 1-15 GPa, brightness can reach 40-90. The hardened layer has no interference effect on electromagnetic signals, and can be applied to 5G and other electronic products with high signal requirements and high surface hardness requirements.

[0051] In a specific example, the first surface of the substrate needs to be surface treated before the hardened layer is applied. Specifically, the surface treatment includes flatness treatment, texture effect treatment and the like. The first surface of the substrate faces outward, and the surface treatment is performed on the first surface to meet the appearance requirements of the composite cover plate.

[0052] In a specific example, in the above-mentioned preparation method of the composite cover plate, when the first surface of the substrate is coated with organic silicon or fluoride to form a hardened layer, the method further includes the following steps: The base acrylate forms an adhesive layer, and then the hardened layer is coated on the adhesive layer.

[0053] 2) Coating a conductive material on the opposite second surface of the substrate to form a conductive coating, and then etching the conductive coating to generate an etching path, which is a conductive layer.

[0054] In a specific example, the conductive material may be a metal conductive material such as copper and silver, or a non-metal conductive material such as carbon.

[0055] In a specific example, the conductive material is coated on the second surface of the substrate by calendering, electroplating or screen printing, and the conductive coating is etched by yellow light etching processing, laser processing or printing etching ink processing. get on.

[0056] 3) Coating an insulating material on the surface of the conductive layer to form a protective layer.

[0057] In a specific example, the coating of the protective layer is to coat the insulating material on the conductive layer by spraying, printing or silk screen printing to form the protective layer.

[0058] In a specific example, a conductive material can be continuously coated on the protective layer to form a conductive coating, and then the conductive coating can be etched to generate an etching path to obtain a conductive layer. Accordingly, multiple conductive layers and protective layers can be prepared according to actual needs to meet different needs.

[0059] In a specific example, the substrate is selected from a composite board of resin and glass fiber, a composite board of resin and glass fiber cloth, a composite board of resin and ceramic powder, or a composite board of resin and ceramic fiber cloth.

[0060] The substrate can also be designed as a substrate with a 3D shape effect according to actual needs.

[0061] In a specific example, in the preparation method of the composite cover plate, the first surface of the substrate is coated with inorganic oxide, alkaline earth metal nitride, alkaline earth metal oxynitride, transition metal nitride, and alkaline earth metal oxynitride to form hardened When layering, it also includes the following step: coating an anti-fingerprint layer on the hardened layer. The anti-fingerprint layer can avoid leaving fingerprint traces when using the electronic product with the above-mentioned composite cover, which affects the appearance.

[0062] In a specific example, the above-mentioned preparation method obtains a composite cover plate, and performs computer digital control precision machining (CNC processing) to obtain composite cover plates of different sizes to meet the different needs of different electronic products for composite cover plates.

Example Embodiment

[0063] Example 1

[0064] The preparation method of the composite cover plate of this embodiment is:

[0065] 1) Copper is plated on the second surface of the substrate by electroplating, and then the copper plated layer is etched by printing and etching ink processing to obtain a conductive layer;

[0066] 2) Print insulating material on the conductive layer to obtain a protective layer;

[0067] 3) Perform surface treatment on the first surface of the substrate;

[0068] 4) Spray PMMA on the first surface of the substrate to obtain an adhesive layer;

[0069] 5) Spray silicone on the adhesive layer to form a 6μm hardened layer;

[0070] 6) Carry out CNC machining and cleaning to get the composite cover plate (see attached figure 1 ).

Example Embodiment

[0071] Example 2

[0072] The preparation method of the composite cover plate of this embodiment is:

[0073] 1) The second surface of the substrate is copper-plated by electroplating, and then the copper-plated layer is etched by printing and etching ink processing to obtain the first conductive layer;

[0074] 2) Print an insulating material on the first conductive layer to obtain a first protective layer;

[0075] 3) Continue to plate copper on the first protective layer, and then etch the copper-plated layer to generate an etching path to obtain a second conductive layer;

[0076] 4) Print an insulating material on the second conductive layer to obtain a second protective layer;

[0077] 5) Perform surface treatment on the first surface of the substrate;

[0078] 6) Carry out vacuum sputtering coating on the first surface of the substrate, and the coating material is SiO 2 , Si 3 N 4 , Si 2 N 2 O mixture to form a 0.8μm hardened layer;

[0079] 7) Spray an anti-fingerprint layer on the hardened layer;

[0080] 8) CNC machining and cleaning are performed to obtain a composite cover plate.

PUM

Property	Measurement	Unit
Nanohardness	1.0 ~ 15.0	GPa
Bending stress	85.0 ~ 438.0	mPa
Thermal conductivity	3.5 ~ 6.7	W/k/m

Description & Claims & Application Information

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Classification and recommendation of technical efficacy words

small size
Improve thermal conductivity

Composite cover plate and preparation method thereof

AI-Extracted Technical Summary

Problems solved by technology

Method used

Abstract

Image

Examples

Example Embodiment

Example Embodiment

Example Embodiment

PUM

Description & Claims & Application Information

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