A mold rapid cooling and rapid heating device using a semiconductor refrigerator and a phase change material

Abstract

The invention provides a mold sudden cooling and sudden heating device adopting a semiconductor refrigerator and a phase change material. The device comprises a control module, a mold heater, a cooling liquid mold channel, a phase change cold storer, a cooling liquid cooling pipe and the semiconductor refrigerator; a phase change part is stored in the phase change cold storer; the cooling liquid mold channel is formed in a mold; the cooling liquid cooling pipe is arranged on the phase change cold storer, and communicates with the cooling liquid mold channel by a controllable valve; a heat endof the semiconductor refrigerator is connected with the mold, and a cold end is connected with the phase change cold storer; when the sudden heating operation is performed on the mold, the heat end ofthe semiconductor refrigerator heats the mold, and the cold end cools the phase change cold storer; and when the sudden cooling operation is performed on the mold, cooling liquid flows in the coolingliquid cooling pipe and the cooling liquid mold channel to quickly cool the mold. Through combination with the advantages of the semiconductor refrigerator and the phase change material, and introduction of a closed-loop feedback control circuit, the device can realize efficient energy-saved sudden cooling and sudden heating adjustment of the mold.

Description

Technical field [0001] The invention relates to the technical field of forming and manufacturing, in particular to a mold quenching and rapid heating device using a semiconductor refrigerator and a phase change material. Background technique [0002] Injection molding and compression molding, as an important molding method in plastic processing, are widely used in various fields of industrial production, and the requirements for precision, surface quality and strength of plastic products are increasing. The traditional plastic molding process is prone to defects such as weld marks, orange peel, and fine lines. If high-quality quenching and heating methods can be used, the mold temperature can be quickly increased to the glass transition temperature of the plastic, and then the mold can be quickly lowered after molding. The temperature to the ejection temperature can effectively eliminate the above defects. Among them, how to quickly realize dynamic mold temperature change and co...

AI Technical Summary

Problems solved by technology

[0003] The plastic molding equipment currently used in the market, in the actual production process, usually heats the entire mold, and the products produced from this often have appearance problems such as weld marks, orange peel, and fine lines, and require secondary processing on the surface; This not only increases energy consumption and production costs, but also has a bottleneck in how to further shorten the molding cycle

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