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A modified composite organic binder

An organic binder and binder technology, applied in the field of external wall thermal insulation bonding materials, can solve the problems of high production cost of polystyrene board bonding mortar, cutting corners, polystyrene board falling off, etc., so as to improve the initial adhesion. The effect of junction capacity, cost reduction, performance improvement

Active Publication Date: 2021-08-06
BEIJING YUEZHU XINTIAN ENERGY SAVING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this method, the redispersible latex powder and cellulose ether must be maintained at a relatively high dosage in order to obtain effective bonding. Therefore, the production cost of polystyrene board bonding mortar remains high, so there is a phenomenon of cutting corners. Occurs, which in turn causes the polystyrene board to fall off the wall easily

Method used

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  • A modified composite organic binder

Examples

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Effect test

Embodiment 1

[0029] A modified composite organic binder, comprising the following components by weight:

[0030] 7 parts of inorganic carrier, 53 parts of cellulose ether, 15 parts of binder, 20 parts of modifier, 5 parts of early strength agent;

[0031] The components are mixed to obtain the modified composite organic binder.

[0032] The inorganic carrier used is obtained by mixing 400 mesh heavy calcium and 400 mesh white carbon black according to the weight ratio of 1:0.1;

[0033] The modifier used is obtained by mixing triethylene glycol diisocaprylate and dioctyl isophthalate in a weight ratio of 1:0.5.

Embodiment 2

[0035] A modified composite organic binder, comprising the following components by weight:

[0036] 6 parts of inorganic carrier, 51 parts of cellulose ether, 17 parts of binder, 18 parts of modifier, 8 parts of early strength agent;

[0037] The components are mixed to obtain the modified composite organic binder.

[0038] The inorganic carrier used is obtained by mixing 400 mesh heavy calcium and 400 mesh white carbon black according to the weight ratio of 1:0.2;

[0039] The modifier used is obtained by mixing triethylene glycol diisocaprylate and dioctyl isophthalate in a weight ratio of 1:1.

Embodiment 3

[0041] A modified composite organic binder, comprising the following components by weight:

[0042] 8 parts of inorganic carrier, 50 parts of cellulose ether, 16 parts of binder, 21 parts of modifier, 5 parts of early strength agent;

[0043] The components are mixed to obtain the modified composite organic binder.

[0044] The inorganic carrier used is obtained by mixing 400 mesh heavy calcium and 400 mesh white carbon black according to the weight ratio of 1:0.5;

[0045] The modifier used is obtained by mixing triethylene glycol diisocaprylate and dioctyl isophthalate in a weight ratio of 1:5.

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Abstract

The embodiments of the present invention relate to the field of thermal insulation adhesive materials for exterior walls, and in particular to a modified composite organic adhesive. The modified composite organic binder provided in the embodiment of the present invention includes the following components: cellulose ether, modifier, inorganic carrier, binder and early strength agent. The modified composite organic binder provided by the embodiment of the present invention is added to the polystyrene board bonding mortar, without adding redispersible latex powder and cellulose ether which are indispensable in the prior art to the bonding mortar, The obtained polystyrene board bonding mortar can effectively bond polystyrene boards, meet the requirements of water retention and construction, and has good storage stability. Under the premise of ensuring that the performance is up to standard, compared with the adhesive mortar of the traditional formula system, the cost of the polystyrene board adhesive mortar prepared by the modified composite organic adhesive provided by the present invention can be reduced by 25%-40%. Excellent value for money.

Description

technical field [0001] The invention relates to the field of external thermal insulation adhesive materials for exterior walls, in particular to a modified composite organic adhesive. Background technique [0002] Among the existing external wall thermal insulation system products, the polystyrene board thin plaster external wall external thermal insulation system has the most mature technology and the largest engineering application area. The most critical technology on the wall of this system is the polystyrene board bonding mortar technology. The traditional method is to obtain the polystyrene board bonding mortar by adding two additives, redispersible latex powder and cellulose ether, to the cement mortar at the same time. The polystyrene board bonding mortar completes the bonding of the base wall and the polystyrene board. However, in this method, the redispersible latex powder and cellulose ether must be maintained at a relatively high dosage in order to obtain effect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B24/38C04B28/04C04B103/44
CPCC04B28/04C04B40/0039C04B2103/44C04B14/28C04B14/022C04B24/383C04B2103/12C04B24/045C04B14/06C04B14/104
Inventor 宋长友王兵涛刘祥枝续俊峰
Owner BEIJING YUEZHU XINTIAN ENERGY SAVING TECH
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