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Aluminum-based copper-clad plate copper foil glue coating process

A technology of aluminum-based copper clad laminate and gluing, applied in the direction of coating, device for coating liquid on the surface, surface pretreatment, etc., can solve the problem of low space utilization rate, high energy consumption of drying operation, low drying efficiency, etc. problems, to achieve the effect of improving high temperature resistance and extreme voltage, reducing equipment construction and maintenance costs, and reducing the demand for production sites

Inactive Publication Date: 2018-12-07
焦作市高森建电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, in the production process of aluminum-based copper-clad laminates, it is necessary to first apply glue to the surface of the copper foil through degumming equipment. At present, when performing glue-coating operations, the maximum thickness is often sprayed on the surface of copper foil through the one-time leg of the glue-coating equipment. The adhesive layer is not greater than 90 microns, and then dried by the drying equipment to obtain the finished adhesive coated copper foil. Although this production process can meet the needs of use, on the one hand, the maximum thickness of the adhesive layer on the surface of the copper foil cannot be greater than 90 microns. Seriously affected the high temperature resistance performance of subsequent aluminum-based copper-clad laminate products, and also led to relatively low extreme voltage of subsequent aluminum-based copper-clad laminate products, which seriously affected the range of use and stability of aluminum-based copper-clad laminate products. On the other hand When coating the copper foil with an adhesive layer, due to the large thickness of the adhesive layer applied at one time, it is easy to cause the relatively poor quality stability of the adhesive layer coating, and the low efficiency of the drying operation of the copper foil after the coating and the drying The defects of large area occupied by drying equipment, low drying efficiency and relatively high energy consumption of drying operation also caused the defects of large occupied area, low space utilization rate and high construction and maintenance costs during the construction of drying equipment. Therefore, In response to this situation, there is an urgent need for a new copper foil glue coating process for aluminum-based copper-clad laminates to meet the needs of actual use.

Method used

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  • Aluminum-based copper-clad plate copper foil glue coating process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A copper foil gluing process for aluminum-based copper-clad laminates, comprising the following steps:

[0018] The first step is to apply glue at a time. The copper foil to be glued passes through the glue coating equipment at a constant speed for surface coating operation. is 100 microns;

[0019] In the second step, one-time drying, the copper foil after the first step of gluing is kept at the same conveying speed as the first step, and the drying operation is carried out through the gluing oven at a uniform speed, wherein the total length of the gluing oven is 12 meters, from front to back, it is divided into four temperature zones: 90°C temperature zone, 140°C temperature zone, 175°C temperature zone and 100°C temperature zone;

[0020] The third step is the second gluing. After the second step is completed, the copper foil that has been dried and preliminarily cooled will be kept at the same speed as the first step and passed through the gluing equipment at a con...

Embodiment 2

[0027] A copper foil gluing process for aluminum-based copper-clad laminates, comprising the following steps:

[0028] The first step is to apply glue at one time. The copper foil to be glued passes through the glue coating equipment at a constant speed for surface coating operation. 75 microns;

[0029] In the second step, one-time drying, the copper foil after the first step of gluing is kept at the same conveying speed as the first step, and the drying operation is carried out through the gluing oven at a uniform speed, wherein the total length of the gluing oven is 12 meters, from front to back, it is divided into four temperature zones: 90°C temperature zone, 140°C temperature zone, 175°C temperature zone and 100°C temperature zone;

[0030] The third step is the second gluing. After the second step is completed, the copper foil that has been dried and preliminarily cooled will be kept at the same speed as the first step and passed through the gluing equipment at a const...

Embodiment 3

[0037] A copper foil gluing process for aluminum-based copper-clad laminates, comprising the following steps:

[0038] The first step is to apply glue at a time. The copper foil to be glued passes through the glue coating equipment at a constant speed for surface coating operation. 90 microns;

[0039] In the second step, one-time drying, the copper foil after the first step of gluing is kept at the same conveying speed as the first step, and the drying operation is carried out through the gluing oven at a uniform speed, wherein the total length of the gluing oven is 12 meters, from front to back, it is divided into four temperature zones: 90°C temperature zone, 140°C temperature zone, 175°C temperature zone and 100°C temperature zone;

[0040] The third step is the second gluing. After the second step is completed, the copper foil that has been dried and preliminarily cooled will be kept at the same speed as the first step and passed through the gluing equipment at a constan...

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Abstract

The invention relates to an aluminum-based copper-clad plate copper foil glue coating process. The aluminum-based copper-clad plate copper foil glue coating process comprises five steps of first gluecoating, first drying, secondary glue coating, secondary drying and cutting of finished products. According to the aluminum-based copper-clad plate copper foil glue coating process, on the one hand, the work efficiency and precision of the copper foil surface glue coating operation can be effectively improved, the quality of a glue layer is improved, and the improvement of the high temperature resistance and extreme voltage of the follow-up aluminum-based copper-clad plate products is facilitated; and on the other hand, the efficiency of the drying operation of the copper foil surface glue layer can be effectively improved, the energy consumption of the drying operation is reduced, the size of drying equipment is effectively reduced, the need of the drying equipment for a production site is reduced, the space utilization is improved and the equipment construction and maintenance costs are reduced.

Description

technical field [0001] The invention relates to a copper foil gluing process for an aluminum-based copper-clad laminate, belonging to the technical field of aluminum-based copper-clad laminate production. Background technique [0002] At present, in the production process of aluminum-based copper-clad laminates, it is necessary to first apply glue to the surface of the copper foil through degumming equipment. At present, when performing glue-coating operations, the maximum thickness is often sprayed on the surface of copper foil through the one-time leg of the glue-coating equipment. The adhesive layer is not greater than 90 microns, and then dried by the drying equipment to obtain the finished adhesive coated copper foil. Although this production process can meet the needs of use, on the one hand, the maximum thickness of the adhesive layer on the surface of the copper foil cannot be greater than 90 microns. Seriously affected the high temperature resistance performance of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D7/14B05D3/02
CPCB05D3/0254B05D7/14B05D7/544B05D2202/45
Inventor 辛凤高辛得才
Owner 焦作市高森建电子科技有限公司
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