Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

H-shaped mushroom-shaped ultra-wideband common-mode noise suppression circuit

A common-mode noise suppression circuit technology, applied in the direction of circuits, electrical components, waveguide devices, etc., can solve the problems of increased circuit area, shallow suppression depth, narrow relative bandwidth of common-mode stop band, etc., to achieve widened bandwidth, The effect of deepening the depth of suppression

Active Publication Date: 2020-04-07
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, most common-mode noise suppression circuits are mainly designed around the defective ground structure, mushroom-type multilayer circuit structure, and transmission line theory. While achieving broadband common-mode noise suppression performance, there are also some problems, such as the common-mode stop band of a single circuit structure. The relative bandwidth is narrow and the suppression depth is shallow. In practical applications, multiple circuit units need to be cascaded to widen the common-mode stopband and deepen the stopband suppression depth, which also increases the actual circuit area.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • H-shaped mushroom-shaped ultra-wideband common-mode noise suppression circuit
  • H-shaped mushroom-shaped ultra-wideband common-mode noise suppression circuit
  • H-shaped mushroom-shaped ultra-wideband common-mode noise suppression circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The technical solution of the present invention will be further introduced below in combination with specific implementation methods and accompanying drawings.

[0024] This specific embodiment discloses an H-shaped mushroom-shaped ultra-wideband common-mode noise suppression circuit, such as figure 1 As shown, including the dielectric substrate 6, the dielectric substrate 6 is divided into two layers, the upper layer is the first layer, and the thickness of the first layer is h 1 , the next layer is the second layer, the thickness of the second layer is h 2 , obviously, h 1 + h 2 is the total thickness of the dielectric substrate 6 . The plate material of the dielectric substrate 6 is Dupont 951, and its relevant electrical parameters are: ε r = 7.8, tan δ = 0.002. The circuit is processed by low-temperature co-fired ceramic (LTCC) process.

[0025] A meandering differential coupling line 1 is provided on the top of the dielectric substrate 6, and the differentia...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an H-shaped mushroom-shaped ultra-wideband common mode noise suppression circuit. The circuit comprises a medium substrate, wherein a top portion of the medium substrate is provided with a winding differential coupling line, the differential coupling line is symmetric to the signal transmission direction, the medium substrate is internally provided with an H-shaped metal patch, the H-shaped metal patch comprises two rectangular patches and a bridge connecting the two rectangular patches, only one rectangular patch is loaded with two short-circuit transmission lines symmetric to the signal transmission direction, a bottom portion of the medium substrate is provided with a ground layer, and the differential coupling line and the two short-circuit transmission lines are connected with the ground layer through metallization through holes. The H-shaped mushroom-shaped ultra-wideband common mode noise suppression circuit has advantages of miniaturization, wide commonmode stop band, deep common mode suppression depth and low differential mode insertion loss.

Description

technical field [0001] The invention relates to electromagnetic field and microwave technology, in particular to an H-shaped mushroom-shaped ultra-broadband common-mode noise suppression circuit. Background technique [0002] The common-mode noise suppression circuit is a circuit structure designed based on the theory of electromagnetic field and microwave technology. Its main function is to ensure the complete transmission of high-speed differential signals in the electronic circuit system while suppressing common-mode noise. [0003] Differential signals are widely used to transmit high-speed digital signals due to their advantages of anti-noise and low electromagnetic interference. For example, high-speed interfaces such as HDMI, USB3.0, SATA-Ⅲ, and PCI-E all use differential wiring to transmit Gbps high-speed digital signals. However, in actual circuits, due to the asymmetry of differential wiring and the imbalance of differential signals (unequal rise and fall times, i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/212
CPCH01P1/212
Inventor 施永荣唐万春周鹏
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com