Soldering paste stirring device for production of computer mainboard

A technology of computer motherboard and stirring device, which is applied in the directions of mixer accessories, mixer, transportation and packaging, can solve the problems of insufficient stirring, poor stirring effect, solder paste bubbles, etc., to ensure the stirring effect, improve production quality, avoid The effect of the entry of air

Inactive Publication Date: 2018-12-11
ANHUI NIKOLA ELECTRONICS TECH CO LTD
View PDF2 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The stirring operation in the existing solder paste production process is usually simple mechanical stirring directly through the stirring shaft. This method has the problems of poor stirring effect and insufficient stirring, and during the

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Soldering paste stirring device for production of computer mainboard
  • Soldering paste stirring device for production of computer mainboard
  • Soldering paste stirring device for production of computer mainboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] Such as figure 1 , figure 2 and image 3 As shown, the present invention provides a solder paste stirring device for computer motherboard production, comprising a stirring base 1, a double-layer stirring barrel 2 with a hollow structure inside is arranged above the stirring base 1, and the double-layer stirring The upper end of the barrel 2 is provided with a raw material addition port 3, the upper end of the raw material addition port 3 is provided ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a soldering paste stirring device for production of a computer mainboard. The soldering paste stirring device comprises a stirring base; a double-layer stirring barrel with a hollow structure inside is arranged above the stirring base; the upper end of the double-layer stirring barrel is provided with a raw material adding opening; a closed opening cover is arranged at theupper end of the raw material adding opening; and a multistage stirring mechanism, an electric heating mechanism, a vacuumizing device and a shielding gas device are arranged inside the double-layer stirring barrel, wherein the electric heating mechanism is used for heating production raw materials, the vacuumizing device is used for carrying out vacuum treatment on the raw materials in the double-layer stirring barrel, and the protective gas device is used for filling the double-layer stirring barrel with shielding gas. The soldering paste stirring device has the advantages that the stirringeffect is guaranteed, the production quality of the soldering paste is improved, the quality difference of the soldering paste caused by uneven stirring is avoided, and the phenomena that air enters the device, so that a large amount of bubbles are easily generated in the soldering paste, and then the surface mounting effect of the soldering paste during subsequent production of the computer mainboard is influenced can be effectively avoided.

Description

technical field [0001] The invention relates to the technical field of computer motherboard production, in particular to a solder paste stirring device for computer motherboard production. Background technique [0002] Computer, commonly known as computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations, logic calculations, and storage and memory functions. It is a modern intelligent electronic device that can run according to programs and process massive amounts of data automatically and at high speed. Equipment consists of hardware systems and software systems. Computers without any software installed are called bare metal, which can be divided into five categories: supercomputers, industrial control computers, network computers, personal computers, and embedded computers. More advanced computers include biological computers, Photonic computers, quantum computers, etc., computer motherboards (generally rectangul...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B01F9/12B01F13/06B01F15/06B01F29/83
CPCB01F29/82B01F29/83B01F33/70B01F35/92B01F2035/99
Inventor 何李元芮望颐黄耀陈大龙
Owner ANHUI NIKOLA ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap