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MEMS device and forming method thereof

A device, the opposite direction technology, applied in piezoelectric devices/electrostrictive devices, semiconductor/solid-state device components, piezoelectric/electrostrictive/magnetostrictive devices and other directions, can solve the problem of large internal stress of the vibrating membrane

Inactive Publication Date: 2018-12-14
SEMICON MFG INT TIANJIN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a kind of MEMS device and its forming method, to solve the problem that its vibrating film has relatively large internal stress in the existing MEMS device

Method used

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  • MEMS device and forming method thereof
  • MEMS device and forming method thereof
  • MEMS device and forming method thereof

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Experimental program
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Embodiment Construction

[0052] In a MEMS device with a vibrating membrane, how to reduce the internal stress of the vibrating membrane and improve the mechanical strength of the vibrating membrane has become one of the most important issues. Corrugations are often formed in the diaphragm to relieve internal stress in the diaphragm.

[0053] figure 1 is a structural schematic diagram of a MEMS device, such as figure 1 As shown, the MEMS device includes a substrate 10 and a vibrating membrane 20 formed on the substrate 10 . The vibrating membrane 20 has a bent part, and the bent part forms a corrugation 21, and the corrugation 21 includes a plurality of protrusions 21a. Since the corrugations 21 are provided in the vibrating membrane 20 , the internal stress of the vibrating membrane 20 can be released when the vibrating membrane 20 is formed.

[0054] continue to refer figure 1 As shown, generally, the protrusions 21 a protrude toward the substrate 10 relative to the non-bending part of the vibrat...

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Abstract

The invention provides an MEMS device and a forming method thereof. The device includes a vibrating membrane forming on a substrate. The vibrating membrane includes a first protrusion and a second protrusion that protrude in opposite directions. The first protrusion protrudes toward the substrate. Among a plurality of protrusions, the protrusions respectively extend in two different directions, thereby avoiding occurrence of internal stress in a corresponding direction due to the corrugation. Therefore, the internal stress in the vibrating membrane can be effectively released when the vibrating membrane is formed, and additional generation of the internal stress can be prevented, so that the formed deformation amount of the vibrating membrane is improved, and the sensitivity of the MEMS device is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a MEMS device and a forming method thereof. Background technique [0002] The microphone is a sensor device that can convert the energy of sound into electrical energy. The capacitive MEMS microphone of Micro Electro Mechanical System (MEMS) technology works by causing the vibrating membrane to vibrate through the sound pressure, so that the capacitor will generate The change in turn causes a change in voltage. Today, with the development of technology and the continuous growth of demand, people's demand for capacitive MEMS microphones is also increasing. [0003] During the working process of the MEMS microphone, external sound pressure acts on the vibrating membrane, thereby causing the vibrating membrane to vibrate. Therefore, the performance of the vibrating membrane will directly affect the performance of the MEMS microphone, for example, the internal stress of the ...

Claims

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Application Information

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IPC IPC(8): B81B7/02B81B3/00
CPCB81B3/0027B81B7/02B81B2201/0257
Inventor 李鑫
Owner SEMICON MFG INT TIANJIN
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