Ceramic capacitor encapsulation structure

A ceramic capacitor and packaging structure technology, which is applied in the direction of fixed capacitor shell/package, fixed capacitor parts, fixed capacitor lead-out, etc., can solve the problems of being susceptible to external interference, function damage, easy damage, etc., and achieve the packaging effect Good, long service life, the effect of improving strength and toughness

Active Publication Date: 2018-12-18
SUCCESS ELECTRONICS HUIZHOU
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a ceramic capacitor packaging structure, which has the advantages of good packaging effect and long service li

Method used

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  • Ceramic capacitor encapsulation structure
  • Ceramic capacitor encapsulation structure
  • Ceramic capacitor encapsulation structure

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] see Figure 1-5 , the present invention provides a technical solution: a ceramic capacitor packaging structure, including a base layer 1 and a glass fiber board 2, the number of the glass fiber boards 2 is two, the base layer 1 is located between the two glass fiber boards 2, and the two glass fiber boards 2 are opposite to each other. One side of the two glass fiber boards 2 is fixedly connected with a stainless steel plate 3, the opposite side of the ...

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Abstract

The invention discloses a ceramic capacitor packaging structure, which comprises a base layer and two fiberglass plates, The base layer is positioned between the two fiberglass plates, the opposite sides of the two fiberglass plates are fixedly connected with stainless steel plates, the opposite sides of the two fiberglass plates are fixedly connected with clamping blocks, the opposite sides of the two clamping blocks are provided with clamping grooves, and the top and bottom of the inner cavity of the base layer are fixedly connected with a buffer layer. Through cooperative use of the stainless steel plate, buffer layer, mounting block, threaded rod, second sealing ring, insulating protective plate, Piston, first sealing ring, hold-down ring, anti-magnetism layer, epoxy resin layer and polytetrafluoroethylene layer, the problem that the ceramic capacitor is liable to be damaged and disturbed by the outside and causing functional damage under the bare condition is solved, the ceramic capacitor encapsulation structure has the advantages of a good encapsulation effect and a long service life, and is convenient for a user to use and suitable for popularization..

Description

technical field [0001] The invention relates to the technical field of detection devices, in particular to a ceramic capacitor packaging structure. Background technique [0002] Ceramic capacitors are made of high dielectric constant capacitor ceramics (barium titanate-titanium oxide) extruded into round tubes, discs or discs as the medium, and silver-plated on the ceramics as electrodes by firing infiltration. It is also There are two types of high-frequency porcelain and low-frequency porcelain. [0003] Ceramic capacitors have become one of the indispensable components of high-power high-voltage electronic products. When exposed, ceramic capacitors are easily damaged and easily disturbed by the external environment, resulting in functional damage. It is very necessary to package ceramic capacitors, so we A ceramic capacitor packaging structure is proposed. Contents of the invention [0004] The purpose of the present invention is to provide a ceramic capacitor packagi...

Claims

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Application Information

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IPC IPC(8): H01G4/224H01G4/002H01G4/236
CPCH01G4/002H01G4/224H01G4/236
Inventor 杨豪
Owner SUCCESS ELECTRONICS HUIZHOU
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