Ceramic capacitor encapsulation structure

Abstract

The invention discloses a ceramic capacitor packaging structure, which comprises a base layer and two fiberglass plates, The base layer is positioned between the two fiberglass plates, the opposite sides of the two fiberglass plates are fixedly connected with stainless steel plates, the opposite sides of the two fiberglass plates are fixedly connected with clamping blocks, the opposite sides of the two clamping blocks are provided with clamping grooves, and the top and bottom of the inner cavity of the base layer are fixedly connected with a buffer layer. Through cooperative use of the stainless steel plate, buffer layer, mounting block, threaded rod, second sealing ring, insulating protective plate, Piston, first sealing ring, hold-down ring, anti-magnetism layer, epoxy resin layer and polytetrafluoroethylene layer, the problem that the ceramic capacitor is liable to be damaged and disturbed by the outside and causing functional damage under the bare condition is solved, the ceramic capacitor encapsulation structure has the advantages of a good encapsulation effect and a long service life, and is convenient for a user to use and suitable for popularization..

Description

technical field [0001] The invention relates to the technical field of detection devices, in particular to a ceramic capacitor packaging structure. Background technique [0002] Ceramic capacitors are made of high dielectric constant capacitor ceramics (barium titanate-titanium oxide) extruded into round tubes, discs or discs as the medium, and silver-plated on the ceramics as electrodes by firing infiltration. It is also There are two types of high-frequency porcelain and low-frequency porcelain. [0003] Ceramic capacitors have become one of the indispensable components of high-power high-voltage electronic products. When exposed, ceramic capacitors are easily damaged and easily disturbed by the external environment, resulting in functional damage. It is very necessary to package ceramic capacitors, so we A ceramic capacitor packaging structure is proposed. Contents of the invention [0004] The purpose of the present invention is to provide a ceramic capacitor packagi...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a ceramic capacitor packaging structure, which has the advantages of good packaging effect and long service life, and solves the problem that ceramic capacitors are easily damaged and easily affected by external interference when they are exposed, resulting in damaged functions.

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