AMOLED panel

Abstract

The embodiment of the invention discloses an AMOLED panel. The AMOLED panel has an edge region between the cutting line and the boundary of the package film. The edge region comprises a flexible substrate, a buffer layer, a first inorganic insulating layer, a second inorganic insulating layer and a first interlayer dielectric layer from bottom to top. The edge region of the AMOLED panel has a structure for preventing crack propagation of an inorganic film. The AMOLED panel includes at least one column of organic deposition patterns arranged in the first inorganic insulating layer, the second inorganic insulating layer and the first interlayer dielectric layer. At least one column is provide with a metal deposition pattern in at least one of that first inorganic insulating lay, the second inorganic insulating layer, and the first interlay dielectric layer. As that embodiment of the invention is implement, problems such as abnormal picture quality cause by crack propagation and the likein the bending process can be improved.

Description

technical field [0001] The invention relates to the display field, in particular to an AMOLED panel. Background technique [0002] In the production of AMOLED (Active-matrix organic light emitting diode, active-matrix organic light-emitting diode) panels, usually large panels are cut by laser to form small panels with required sizes. On the one hand, because the inorganic film layer at the edge of the panel will cause micro-cracks invisible to the naked eye when cutting, on the other hand, a large number of dangling bonds and defects are formed due to the sudden termination of the crystal lattice at the edge, so the unstable edge area is usually will be the initiation site for cracks. When the AMOLED panel is bent during use, the intrinsic stress in the inorganic film and the extrinsic stress from the adhesion of the film to the substrate will continue to promote the further expansion of microcracks. Under repeated bending, when the inorganic packaging film with intrinsic ...

AI Technical Summary

Problems solved by technology

see also figure 2 In the cross-sectional view of the AMOLED panel, in the panel edge area 3' of the AMOLED panel, a flexible substrate 30', a buffer layer 31', a first inorganic insulating layer 32', a second inorganic insulating layer 33' and a second inorganic insulating layer are arranged in sequence from bottom to top An interlayer dielectric layer 34'; in order to slow down the propagation of cracks into the board, a blocking structure 6' can be designed at the edge of the cutting line of the panel, but there are only some shortcomings in this type, that is, it is difficult to Prevent the rapid expansion of microcracks caused by different frequencies and thousands of times of bending. On the other hand, because the blocking structure 6' is too close to the cutting line, it is easy to cause the blocking structure 6' to be overcut. The damage and completely lose the role of crack prevention

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