Multilayer circuit board, manufacturing method, and computer-readable storage medium
A technology of multi-layer circuit board and manufacturing method, which is applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., and can solve the problems such as difficulty in controlling the equivalent capacitance and equivalent inductance of signal holes and affecting the signal performance in the circuit
Active Publication Date: 2020-01-17
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
View PDF4 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
In the existing multi-layer circuit board, the priority is the difficulty of getting out of the line when the line is changed. The layer change of the line is relatively random, which makes it difficult to control the equivalent capacitance and equivalent inductance of the signal hole, thus affecting the signal in the circuit. performance
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only some structures related to the present application are shown in the drawings but not all structures. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.
[0019] The manufacturing method of the present application is applied to the design of multilayer circuit boards. In the design of multilayer circuit boards in the prior art, a signal hole is usually used for layer-change connection between circuit...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a multilayer circuit board, a manufacturing method and a computer-readable storage medium, wherein the manufacturing method comprises the following steps of: obtaining the reactance characteristics of a packaged chip of the multilayer circuit board; determining the size of the signal hole of the multilayer circuit board or the size of the signal hole, the diameter of the padand the size of the reverse pad; determining the number of signal holes according to the reactance characteristic and the size of the signal holes, or the number of signal holes is determined according to the reactance characteristic, the size of the signal holes, the diameter of the pad, and the size of the counter pad. The invention conveniently controls the equivalent capacitance and the equivalent inductance of the signal hole, and improves the performance of the signal in the circuit.
Description
technical field [0001] The present application relates to the field of circuit board manufacturing, in particular to a multilayer circuit board, a manufacturing method and a computer-readable storage medium. Background technique [0002] The multi-layer circuit board formed by multi-layer circuit layers and adding a dielectric layer between every two circuit layers has the advantages of high assembly density, small size, and light weight. [0003] When electrically connecting the circuit layers in the multilayer circuit board, the layer-changing electrical connection is usually performed through conductive signal holes. In existing multi-layer circuit boards, the priority of wiring is the difficulty of getting out of the line when the line is changed. The layer change of the line is relatively random, which makes it difficult to control the equivalent capacitance and equivalent inductance of the signal hole, thus affecting the signal in the circuit. performance. Contents ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/40
CPCH05K3/00H05K3/4038
Inventor 姚坤
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD