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Three-dimensional molding method

A technology of three-dimensional forming and imaging device, applied in the directions of additive manufacturing, 3D object support structure, manufacturing tools, etc., can solve the problems of difficult control and realization, complex device structure, etc., and achieve the effect of improving the efficiency of leveling and replenishment, and improving the efficiency.

Inactive Publication Date: 2019-01-04
吴晶军
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main defect of this device is that oxygen needs to be continuously applied during the 3D printing process, and the resin tank needs to form a closed space to maintain the balance point of oxygen molecular concentration, which makes the structure of the device complicated and difficult to control and realize.

Method used

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  • Three-dimensional molding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Morpholine Acrylate 60g

[0044] Hexylene glycol diacrylate 40g

[0045] Irgacure 819 3g

[0046] Methicone 3g

[0047] Pre-treatment method: heating in a 60-degree oven for 30 minutes, keeping the resin temperature at 40 degrees during the printing process, and printing speed at 30cm / h (slice thickness is 100 microns).

Embodiment 2

[0054] Polyethylene glycol (700) diacrylate 30g

[0055] Hexylene glycol diacrylate 70g

[0056] Irgacure 819 3g

[0057] Pre-treatment method: Nitrogen (2-3 bubbles / minute) bubbles for 5 minutes, keep the resin temperature at 40 during the printing process, and print at a speed of 40cm / h (slice thickness of 100 microns).

Embodiment 3

[0064] Morpholine Acrylate 60g

[0065] Hexylene glycol diacrylate 40g

[0066] Irgacure 819 3g

[0067] Polyethylene glycol 3g

[0068] Pretreatment method: Nitrogen (2-3 bubbles / minute) bubbles for 10 minutes, printing speed is 30cm / h (slice thickness is 100 microns).

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Abstract

The invention relates to a three-dimensional molding method. Photosensitive resin in a resin groove is irradiated by a surface exposure imaging device and solidified to be molded on a sunken molding platform; the photosensitive resin is pretreated before being subjected to stereo lithography apparatus, thereby reducing the content of dissolved oxygen in the photosensitive resin. The method omits the conversion process form a molding solid-air interface to a liquid photosensitive resin-air interface, thereby greatly increasing the efficiency of three-dimensional molding and also avoiding a complex device structure.

Description

technical field [0001] The invention relates to rapid prototyping technology, in particular to a three-dimensional prototyping method. Background technique [0002] Light-curing 3D printing uses liquid photosensitive resin as the printing material, which is cured with light of a specific wavelength. The whole process has no mechanical force and heating process, and has the highest molding precision. Photocuring 3D printing mainly includes two types of technologies: Stereolithography (SLA) and Digital Light Processing (DLP). Among them, DLP light-curing 3D printing is formed through surface exposure, which has a higher printing speed. However, after each layer is exposed, it is necessary to wait for the time for resin backfill replenishment (resin replenishment time is usually longer than the exposure time), so even if it is a DLP-type light-curing printing technology, its absolute speed is still not high enough, usually 2- 4cm / h. [0003] Carbon Corporation of the United ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C64/129B29C64/20B29C64/314B33Y30/00B33Y10/00B33Y40/00
CPCB29C64/129B29C64/20B29C64/314B33Y10/00B33Y30/00B33Y40/00B29C64/135B33Y40/10
Inventor 吴晶军
Owner 吴晶军
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