satellite dish cover
A satellite antenna and cover technology, applied in the field of satellite antennas, can solve the problems of conversion, antenna cover stability, energy waste, etc., to achieve smooth charge flow, improve electrical conductivity, and save resources.
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Embodiment 1
[0031] The invention provides a satellite antenna cover, which combines Figure 1 to Figure 3 As shown, it includes a top cover 1 and a bottom case 2, the top cover 1 is fastened on the bottom case 2, and an accommodating cavity 3 for installing a satellite antenna 4 is formed between the top cover 1 and the bottom case 2, and the top cover 1 and the bottom case 2. The connection is sealed. The satellite antenna 4 is located in the housing cavity 3. The bottom shell 2 is also provided with a terminal 5. The satellite antenna 4 is connected to the outside through the terminal 5. A piezoelectric energy harvester 6 is provided on the inner wall of the upper cover 1. , for converting the energy generated by the vibration of the upper cover 1 into electrical energy.
[0032] The outer cover of the satellite antenna of the present invention is provided with a piezoelectric energy collector 6 in the upper cover 1 of the outer cover, and the vibration generated on the surface of the u...
Embodiment 2
[0034] As the satellite antenna cover described in the first embodiment above, the difference of this embodiment is that, in combination with Figure 4 to Figure 6 As shown, the piezoelectric energy harvester 6 includes a piezoelectric layer 17 and a substrate 18, and the first adhesive layer 7 is applied between the piezoelectric layer 17 and the substrate 18, and the two are bonded together through a bonding process at a certain temperature and pressure. or are bonded together, so as to effectively control the thickness of the compression energy harvester 6, making its thickness as small as possible.
[0035] The substrate 18 includes a first base 8 , a second adhesive layer 9 , and a first conductive layer 10 .
[0036] The first base 8 is made of silicon material, the front of the first base 8 is provided with a front groove, and the back of the first base 8 is provided with a back groove, wherein the cross-sections of the front groove and the back groove are both "L" Typ...
Embodiment 3
[0046] As the satellite antenna cover described in the second embodiment above, the difference of this embodiment is that, in combination with Figure 7 and Figure 8 Shown, the processing method of piezoelectric energy harvester 6 comprises:
[0047] The substrate 18 is manufactured, and a oriented silicon wafer is used as the first base 8. In other embodiments, the first base 8 may also use materials such as germanium, silicon germanium, and silicon carbide. After performing a double-sided polishing (such as CMP) planarization process on the first base 8 to reduce surface defects and reduce roughness, a patterned protective layer 16 is prepared on the upper and lower surfaces of the first base 8. The protective layer 16 is silicon nitride. It is formed by depositing silicon oxide (preferably a low-temperature CVD process), and its deposition temperature is 600-900°C, and preferably 780°C. The patterned shape of the protective layer 16 prepared on the first base 8 is a rect...
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