An MCM integrated circuit packaging production line integrated with an SMT process

A production line and integrated circuit technology, applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve problems such as slow speed and low precision, and achieve the effects of reducing production costs, improving production efficiency, and increasing chip loading speed

Pending Publication Date: 2019-01-11
WUXI HAOBANG HIGH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when a variety of components are packaged, active devices such as MOS, passive devices such as resistors and capacitors, and silicon chips are packaged in the same package, the 0.1mm 2 Soldering resistors and capacitors with 1mm-level silicon chips are slow in speed and low in precision

Method used

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  • An MCM integrated circuit packaging production line integrated with an SMT process
  • An MCM integrated circuit packaging production line integrated with an SMT process
  • An MCM integrated circuit packaging production line integrated with an SMT process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] Embodiment 1, see figure 1 A triode and two chips are arranged on a lead frame of an MCM integrated circuit packaging structure fused with SMT. The triode is welded on the lead frame by solder paste, and the chip is pasted on the lead frame by silver glue.

[0081]

Embodiment 2

[0082] Embodiment 2, see figure 2 A MOS transistor and three chips are arranged on a lead frame of an MCM integrated circuit packaging structure fused with SMT. The MOS tube is welded on the lead frame with solder paste, and the chip is pasted on the lead frame with silver glue.

[0083]

Embodiment 3

[0084] Embodiment 3, see image 3 , a common silicon and four chips are set on the lead frame of an MCM integrated circuit package structure fused with SMT. Ordinary silicon is welded on the lead frame with solder paste, and the chip is pasted on the lead frame with silver glue.

[0085]

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Abstract

The invention relates to an MCM integrated circuit packaging production line integrated with an SMT process, which is characterized in that it comprises,in this order from front to back, a lead frameloading device (101), a steel screen printing apparatus (102), a first AOI automatic optical detection device (103) an active device mounting device (104), a reflow soldering device (105), a second AOI automatic optical detection device (106), a chip mounting device (107), a first baking device (108), a bonding device (109), a plastic sealing device (110), a second baking device (111), a marking device (112), an electroplating device (113), a molding rib cutting device (114), and an appearance detection packaging device (115). The MCM integrated circuit packaging production line integrating SMT process has the advantages of improving production efficiency, reducing production cost and ensuring product quality.

Description

technical field [0001] The invention relates to an MCM integrated circuit packaging production line integrated with SMT process. Background technique [0002] The traditional MCM integrated circuit packaging structure is generally produced in one form of primary packaging or secondary packaging alone. [0003] First-level packaging refers to single-chip packaging or multi-chip packaging on a metal lead frame, and the chip is mounted on the lead frame through silver glue. [0004] Secondary packaging refers to various components and integrated circuits, which are soldered on the circuit board by SMT. SMT is Surface Mount Technology (Surface Mount Technology) (abbreviation for Surface Mount Technology), known as surface mount or surface mount technology. It is the most popular technology and process in the electronic assembly industry. SMT is a kind of non-pin or short-lead surface mount components (SMC / SMD for short, Chinese called chip components) mounted on the surface o...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67011H01L21/67121H01L21/67144
Inventor袁野全庆霄王辉张巧杏王嫚
OwnerWUXI HAOBANG HIGH TECH CO LTD