Precision reprocessing method of leaf spring

Abstract

The invention discloses a precision reprocessing method of a leaf spring, and relates to a processing method of leaf spring parts. The precision reprocessing method mainly comprises the following steps that the second reference surface of the leaf spring is adhered to a first-level optical contact pad plate by yellow wax rosin size with a ratio of 1: 3; the optical contact pad plate is turned upside down onto a grinding disc of a single-shaft machine special for grinding, and the first reference surface of the leaf spring is ground successively with W28, W14 and W7 white corundum, and finallya sanded hole with low aperture and without scratches is formed by grinding; the optical contact pad plate is continued to be turned upside down to a polishing disc of a single-shaft machine special for polishing, the first reference surface of the leaf spring is polished with cerium oxide polishing powder, and finally the first reference surface of the leaf spring is detected as lambda / 2@633nm byan interferometer; and the first reference surface is then processed in the same way. According to the precision reprocessing method, the stress is uniform during the grinding and polishing processes, and the processing deformation of the leaf spring is avoided; the method of optical contact is adopted to avoid the influence of adhesive layer error on the end face processing of the leaf spring; and the thickness error of the leaf spring is increased from + / -0.01 mm to + / -0.004 mm, and the qualified rate of leaf spring assembly is increased by 67%.

Description

technical field [0001] The invention relates to a processing method for leaf spring parts, in particular to a method for precisely reprocessing leaf springs for seismic equipment using a leaf spring suspension scheme. Background technique [0002] Leaf spring is an important elastic part of precision instruments. It is widely used in seismic equipment with leaf spring suspension scheme. Its quality will directly affect the assembly quality and accuracy of seismic equipment. The load deformation characteristic is the main performance parameter of the leaf spring, which is closely related to the height-thickness ratio. The traditional processing method for the leaf spring is cold rolling, which can greatly improve the elastic limit and tensile strength of the leaf spring, but the thickness accuracy of the leaf spring can only reach ±0.01mm. During the assembly process, we found that the load deformation characteristic error caused by the high-thickness ratio is relatively lar...

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Problems solved by technology

During the assembly process, we found that the error of the load deformation characteristic caused by the high-thickness ratio is relatively large, and the qualified rate of cold-rolled leaf spring assembly is only 33%.

The main way to improve the processing accuracy of the leaf spring is grinding, but this method will cause serious warping and deformation of the leaf spring. In addition, the leaf spring is non-magnetic and cannot be directly adsorbed to the magnetic chuck. It requires a transition of the adhesive layer, and the error of the adhesive layer is difficult Estimated, so using this method can not improve leaf spring thickness accuracy

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