Auxiliary assembly structure and construction method for collimating dmd lithography system

Abstract

An auxiliary mounting structure for collimating DMD lithography system and a construction method thereof, belonging to the field of optical experiment auxiliary structure equipment, in particular to an auxiliary mounting structure for a DMD lithographic projection system and a construction method thereof, comprises a DMD spatial modulator, a 405nm continuous laser light source, a tube lens I, a semi-transparent semi-reflective mirror, a tube lens II, a CCD camera, a 45-degree reflective mirror, a projection objective lens, a manual large-stroke three-dimensional displacement stage, a piezoelectric stage, an adapter and an adjustable sample stage; The invention provides an auxiliary mounting structure of a collimated DMD lithography system with high precision and convenient assembly and debugging, A DMD lithographic projection system is provide, in which that plane of the DMD chip is perpendicular to the optical axis of the optical system and the optical axis of the optical system is perpendicular to the plane of the substrate to be processed, so as to obtain an auxiliary mount structure and a construction method of the DMD lithographic projection system with optimum lithographic exposure accuracy and quality, and is suitable for popularization and implementation in various laboratories.

Description

technical field [0001] The invention belongs to the field of auxiliary structure equipment for optical experiments, and in particular relates to an auxiliary assembly and adjustment structure for a DMD lithography projection system and a construction method thereof. Background technique [0002] Since the 1960s, lithography technology has been supporting the realization and development of integrated circuits in the semiconductor industry, from the integration of dozens of devices on a single chip to the integration of more than one billion devices on a single chip. Although traditional lithography technology has played an irreplaceable role in the semiconductor chip preparation process, its expensive equipment, harsh environmental requirements and high access conditions limit its service to the majority of scientific researchers; in addition, with the characteristics of semiconductor chips The size is getting smaller and smaller, and the requirements for the manufacturing pr...

AI Technical Summary

Problems solved by technology

This surface projection lithography technology has very high requirements on the linearity of the optical system, and requires the optical axis of the projection optical system to be strictly perpendicular to the plane where the DMD chip and the substrate to be processed are located, because it directly affects the accuracy and quality of lithography.

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