A graphical machining method of bulk piezoelectric ceramics for micro-device applications
A technology of piezoelectric ceramics and micro-devices, applied in piezoelectric/electrostrictive/magnetostrictive devices, circuits, electrical components, etc., to achieve high precision
Active Publication Date: 2019-01-15
NAT INST CORP OF ADDITIVE MFG XIAN
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Problems solved by technology
[0010] In order to solve the technical problems existing in the high-precision machining of existing piezoelectric ceramics, the present invention provides a patterned processing method for bulk piezoelectric ceramics oriented to the application of micro devices
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[0032] The present invention will be described in detail below by taking a comb-shaped piezoelectric ceramic micro-device as an example in conjunction with the accompanying drawings.
[0033] Figure 1-2 Shown is the piezoelectric ceramic substrate of the comb-shaped piezoelectric ceramic micro-device manufactured by the embodiment of the present invention. Depend on Figure 1-2 It can be seen that the piezoelectric ceramic substrate includes an upper surface electrode 1, a PZT substrate 3 and a bottom counter electrode 2, the top surface electrode 1 is positioned on the surface of the PZT substrate 3; the bottom counter electrode 2 is positioned on the bottom surface of the PZT substrate 3, and From the side wall of the PZT substrate 3 back to the surface layer, usually at the edge of the surface layer upper electrode 1, and separated from the surface layer upper electrode 1 by the isolation groove 4, the separation of the upper and lower electrodes is realized without affec...
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Abstract
The invention provides a graphical processing method of bulk piezoelectric ceramics for micro-device application, which comprises the following steps of: 1) printing a processing path of a device to be processed on an electrode on a surface layer of the piezoelectric ceramics; 2) cutting the whole piezoelectric ceramic according to the pattern printed in the step 1) by adopting a scriber to form aplurality of deformation units in the device to be processed; 3) separating the electrodes on the surface layer of the piezoelectric ceramic according to the pattern printed in step 1) by using femtosecond laser to form a plurality of lead electrodes which are connected with a plurality of deformation units correspondingly. The invention relates to a bulk piezoelectric ceramic graphical machiningmethod for micro-device application, Combined with the structure of piezoelectric ceramic micro-device, the advantages of machining technology and laser ablation technology are utilized to avoid thedisadvantages of machining technology and laser ablation technology, and the difficult problem of high precision machining of piezoelectric ceramic micro-device is solved.
Description
technical field [0001] The invention belongs to the technical field of piezoelectric ceramic processing, and relates to a patterned processing method of bulk piezoelectric ceramics oriented to the application of micro devices. Background technique [0002] Piezoelectric ceramics, as new functional ceramic devices, have a wide range of applications as microsensors and actuators in energy harvesting, signal transmission and other applications. [0003] Piezoelectric ceramics are divided into bulk piezoelectric ceramics and film piezoelectric ceramics according to thickness. Generally speaking, piezoelectric ceramics with a thickness of more than 10 μm are called bulk piezoelectric ceramics, and piezoelectric ceramics with a thickness of less than 10 μm are called It is a film-like piezoelectric ceramic. [0004] Due to the physical characteristics of ceramic materials such as brittleness and hardness, their precision and ultra-precision processing methods are severely limited...
Claims
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IPC IPC(8): H01L41/293H01L41/338H01L41/047H10N30/063H10N30/088H10N30/87
CPCH10N30/872H10N30/063H10N30/088
Inventor 王莉牛中会黄菲卢秉恒
Owner NAT INST CORP OF ADDITIVE MFG XIAN