A patterned processing method for bulk piezoelectric ceramics for micro-device applications
A technology of piezoelectric ceramics and micro devices, which is applied in the direction of piezoelectric/electrostrictive/magnetostrictive devices, circuits, electrical components, etc., to achieve the effect of high-precision processing
Active Publication Date: 2022-05-10
NAT INST CORP OF ADDITIVE MFG XIAN
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0010] In order to solve the technical problems existing in the high-precision machining of existing piezoelectric ceramics, the present invention provides a patterned processing method for bulk piezoelectric ceramics oriented to the application of micro devices
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0032] The present invention will be described in detail below by taking a comb-shaped piezoelectric ceramic micro-device as an example in conjunction with the accompanying drawings.
[0033] Figure 1-2 Shown is the piezoelectric ceramic substrate of the comb-shaped piezoelectric ceramic micro-device manufactured by the embodiment of the present invention. Depend on Figure 1-2 It can be seen that the piezoelectric ceramic substrate includes an upper surface electrode 1, a PZT substrate 3 and a bottom counter electrode 2, the top surface electrode 1 is positioned on the surface of the PZT substrate 3; the bottom counter electrode 2 is positioned on the bottom surface of the PZT substrate 3, and From the side wall of the PZT substrate 3 back to the surface layer, usually at the edge of the surface layer upper electrode 1, and separated from the surface layer upper electrode 1 by the isolation groove 4, the separation of the upper and lower electrodes is realized without affec...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
Login to View More
Abstract
The present invention proposes a patterned processing method for bulk piezoelectric ceramics oriented to the application of micro devices, including 1) printing the processing path of the device to be processed on the surface of the piezoelectric ceramics; 2) using a dicing machine, according to the steps 1) The printed graphics cut the piezoelectric ceramics as a whole to form multiple deformation units in the device to be processed; 3) Using a femtosecond laser, according to the printed graphics in step 1), the surface layer of the piezoelectric ceramics The upper electrodes are separated to form a plurality of lead-out electrodes correspondingly connected to a plurality of deformation units. The micro-device application-oriented bulk piezoelectric ceramic patterned processing method of the present invention combines the structure of the piezoelectric ceramic micro-device itself, comprehensively utilizes the advantages of mechanical processing technology and laser ablation technology, and avoids mechanical processing technology and laser ablation technology. Their respective disadvantages solve the problem of high-precision machining of piezoelectric ceramic micro-devices.
Description
technical field [0001] The invention belongs to the technical field of piezoelectric ceramic processing, and relates to a patterned processing method of bulk piezoelectric ceramics oriented to the application of micro devices. Background technique [0002] Piezoelectric ceramics, as new functional ceramic devices, have a wide range of applications as microsensors and actuators in energy harvesting, signal transmission and other applications. [0003] Piezoelectric ceramics are divided into bulk piezoelectric ceramics and film piezoelectric ceramics according to thickness. Generally speaking, piezoelectric ceramics with a thickness of more than 10 μm are called bulk piezoelectric ceramics, and piezoelectric ceramics with a thickness of less than 10 μm are called It is a film-like piezoelectric ceramic. [0004] Due to the physical characteristics of ceramic materials such as brittleness and hardness, their precision and ultra-precision processing methods are severely limited...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L41/293H01L41/338H01L41/047H10N30/063H10N30/088H10N30/87
CPCH10N30/872H10N30/063H10N30/088
Inventor 王莉牛中会黄菲卢秉恒
Owner NAT INST CORP OF ADDITIVE MFG XIAN