Unlock instant, AI-driven research and patent intelligence for your innovation.

Trigger and chip

A flip-flop and latch technology, applied in electrical components, reliability improvement and modification, logic circuits, etc., can solve the problems of unable to monitor the working status of the flip-flop in real time, unable to realize the SEU error detection function, etc.

Active Publication Date: 2019-01-15
LOONGSON TECH CORP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the existing anti-SEU flip-flops cannot realize the error detection function of SEU, so it is impossible to monitor the working status of the flip-flop in the radiation environment in real time

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Trigger and chip
  • Trigger and chip
  • Trigger and chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0045] The terms "first", "second", "third", etc. (if any) in the description and claims of the present application and the above drawings are used to distinguish similar objects and not necessarily to describe a specific order or sequentially. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application described herein, for example, can be practiced in sequences other than those illustrated or describ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the present application provides a trigger and a chip. The trigger includes an error correction circuit and an error detection circuit; wherein the first input end of the error correction circuit serves as a data input end of the trigger; the output end of the error correction circuit is connected to the first input end of the error detection circuit; the second input end of theerror detection circuit serves as a clock input end of the trigger; and the output end of the error detection circuit is connected to the second input end and the third input end of the error correction circuit. The error detection circuit is configured to send an error correction signal to the error correction circuit when detecting that the trigger generates a single event upset (SEU). The errorcorrection circuit is configured to subject the trigger to error correction processing when receiving the error correction signal. It can be seen that, on the basis of an error correction function, the working state of the trigger in a radiation environment is monitored in real time, so as to achieve accurate estimation of the working performance of the trigger in the radiation environment.

Description

technical field [0001] The present application relates to circuit technology, in particular to a flip-flop and a chip. Background technique [0002] Under normal circumstances, in the case of some harsh radiation environments, integrated circuits (Integrated Circuit, IC) are often disturbed, for example, a single high-energy particle is injected into the semiconductor device in the IC circuit, causing the logic state of the semiconductor device to flip (such as the logic state Change from low level to high level, or logic state from high level to low level), this effect is called single event upset (Single event upse, SEU). Because SEU can cause IC circuit system dysfunction, and catastrophic accidents will occur in serious cases, how to realize anti-SEU has become a research hotspot for researchers. [0003] In the prior art, two hardened latches based on triple redundancy are usually used in series to form a flip-flop against SEU. figure 1 It is a structural schematic di...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H03K19/003
CPCH03K19/00338
Inventor 刘延科范宝峡杨宗仁丁健平邱国
Owner LOONGSON TECH CORP