Three-dimensional printing device capable of realizing electric field induction assisted electrospray

An electric field induction and three-dimensional printing technology, which is applied in processing and manufacturing, liquid material additive processing, additive processing, etc., can solve problems such as difficult to manufacture three-dimensional structures, limited nozzle hole processing, and difficult to realize submicron and below structure processing. , to achieve the effect of fast forming speed and high printing resolution

Active Publication Date: 2019-01-18
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, 3D printing technology mainly adopts layer-by-layer direct writing, which is accumulated layer by layer to form a 3D structure, and it is difficult to manufacture complex 3D structures.
In addition, the resol

Method used

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  • Three-dimensional printing device capable of realizing electric field induction assisted electrospray
  • Three-dimensional printing device capable of realizing electric field induction assisted electrospray
  • Three-dimensional printing device capable of realizing electric field induction assisted electrospray

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Embodiment Construction

[0023] The specific implementation manners of the present invention will be described in detail below in conjunction with the technical solutions and accompanying drawings. An embodiment of a three-dimensional printing device using electric field induction assisted electrospray mainly includes an electrospray printing module and an electric field induction forming module.

[0024] The precision syringe 2 has a volume range of 25-1000 μL and is placed on the precision syringe pump 1. The precision syringe 2 inhales the silver sol functional material solution 3, and passes through the catheter 4. 5μLmin -1 The flow rate of the functional material solution 3 is transported to the nozzle of the injection needle 6; the injection needle clamp 5 is fixed on the Z axis for holding the injection needle 6, and the injection needle 6 is made of stainless steel or quartz material, and the inner diameter is 5- 500 μm; the camera 7 presents the jet behavior in the printing process in the m...

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Abstract

The invention belongs to the technical field of advanced manufacture and relates to a device for manufacturing a three-dimensional structure by electric field induction assisted electrospray printing.The device comprises an electrospray printing module and an electric field induced forming module. The electrospray printing module is used for delivering a functional material solution into a sprayneedle, shearing the functional material solution by utilizing an electric field force applied to the spray needle to form a micro/nano-scale stable jet flow smaller than the size of the spray needleand printing a micro/nano structure; and the electric field induced forming module is used for regulating and controlling the structure by utilizing a spatial electric field force generated by an induction electrode, and a complex micro/nano three-dimensional structure is obtained by electric field induction, stress deformation, cooling for curing and three-dimensional molding. The complex micro/nano three-dimensional structure manufactured by using the three-dimensional printing device disclosed by the invention has the advantages such as free molding of the spatial three-dimensional structure, high printing resolution and high molding speed, the complex micro/nano three-dimensional structure manufactured by using the device has the line width of dozens of nanometers, and the complex micro/nano three-dimensional structure manufactured by printing is widely applied to the fields such as electronics, information and energy.

Description

technical field [0001] The invention belongs to the field of advanced manufacturing technology, and relates to a three-dimensional printing device for electric field-induced assisted electrospraying. Background technique [0002] With the improvement of device performance and integration, the functional structure of the device has gradually developed from a two-dimensional structure to a three-dimensional structure. For example, the three-dimensional micro-electromechanical system based on the cantilever beam structure provides a larger bandwidth and adjustable frequency than the two-dimensional system; compared with the macro-optoelectronic device, the micro-optoelectronic device is not only small in size, light in weight, but also low in power consumption. Therefore, the micro / nano three-dimensional structure plays an important role in the miniaturization, integration, and energy saving of high-performance devices. In addition, as the sensing unit of high-performance devi...

Claims

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Application Information

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IPC IPC(8): B29C64/106B29C64/20B33Y10/00B33Y30/00
CPCB29C64/106B29C64/20B33Y10/00B33Y30/00
Inventor 王大志李凯贾皓然任同群梁军生
Owner DALIAN UNIV OF TECH
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