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Vapor chamber and manufacturing method thereof

A manufacturing method and sheet technology, applied in electrical components, polyether adhesives, circuit thermal devices, etc., can solve the problems of affecting device function, poor heat resistance, small thermal conductivity, etc. Chain density, the effect of improving thermal conductivity

Active Publication Date: 2019-11-08
QING DING PRECISION ELECTRONICS HUAIAN CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the poor heat resistance of the glue, the glue is easy to generate air bubbles when heated, causing local overheating, thereby affecting the function of the device
In addition, most adhesive materials have low thermal conductivity, which makes the temperature between the adhesive material and the conductive circuit uneven, which will further affect the function of the device

Method used

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  • Vapor chamber and manufacturing method thereof
  • Vapor chamber and manufacturing method thereof
  • Vapor chamber and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] The adhesive layer 30 includes 35 parts by weight of styrene-butadiene-styrene block copolymer, 60 parts by weight of styrene-ethylene-butylene-styrene block copolymer, 10 parts by weight of polystyrene Phenyl ether, 40 parts by weight of dendritic acrylate oligomer, 7 parts by weight of heat conducting powder, 15 parts by weight of flame retardant and 3 parts by weight of ion scavenger. The thermal conductivity of the adhesive layer 30 in the first embodiment is 2.1 W / m.k.

Embodiment 2

[0053] The adhesive layer 30 includes 35 parts by weight of styrene-butadiene-styrene block copolymer, 60 parts by weight of styrene-ethylene-butylene-styrene block copolymer, 10 parts by weight of polyphenylene ether , 40 parts by weight of dendritic acrylate oligomer, 16 parts by weight of thermally conductive powder, 15 parts by weight of flame retardant and 3 parts by weight of ion scavenger. The thermal conductivity of the adhesive layer 30 in the first embodiment is 2.8 W / m.k.

Embodiment 3

[0055] The adhesive layer 30 includes 55 parts by weight of styrene-butadiene-styrene block copolymer, 40 parts by weight of styrene-ethylene-butylene-styrene block copolymer, 20 parts by weight of polyphenylene ether , 30 parts by weight of dendritic acrylate oligomer, 7 parts by weight of heat conducting powder, 15 parts by weight of flame retardant and 3 parts by weight of ion scavenger. The thermal conductivity of the adhesive layer 30 in the first embodiment is 1.9 W / m.k.

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PUM

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Abstract

A uniform temperature plate includes a release film and a uniform temperature plate. The temperature equalizing board includes at least one insulating layer and an adhesive layer, and the adhesive layer is arranged on at least one insulating layer. The release film is arranged on the outer surface of the adhesive layer. The adhesive layer comprises 35-85 parts by weight of styrene-butadiene-styrene block copolymer, 5-65 parts by weight of styrene-ethylene-butylene-styrene block copolymer, 5- 35 parts by weight of polyphenylene ether, 3-45 parts by weight of dendritic acrylate oligomer.

Description

technical field [0001] The invention relates to a circuit board, in particular to a uniform temperature board and a manufacturing method thereof. Background technique [0002] Devices such as thermistors, temperature sensors, and temperature control switches control the temperature at the line through voltage changes, thereby realizing their respective functions. [0003] The circuits of the above-mentioned devices are usually bonded by glue. However, due to the poor heat resistance of the glue material, bubbles are easily generated when the glue material is heated to cause local overheating, thus affecting the function of the device. In addition, most adhesive materials have low thermal conductivity, which makes the temperature between the adhesive material and the conductive circuit uneven, which will further affect the function of the device. [0004] To sum up, it is necessary to provide a vapor chamber with stable performance and uniform heating and a manufacturing me...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J153/02C09J171/12C09J133/04C09J11/04C09J11/06H05K1/02
CPCH05K1/0201C09J11/04C09J11/06C09J153/02C09J153/025C08K2003/2227C08K2003/282C08K2003/385C08L2205/02C08L2205/035C08L53/02C08L71/12C08L33/04C08K3/36C08K3/22C08K3/38C08K3/28C08K3/32C08K5/523C08K5/34928C08L53/025H05K1/0353H05K1/0373H05K2201/0209C08L101/005C08L33/08C08F210/02C08F212/08C08F236/06C08F2800/20C08K5/0066C08K2003/285C09J109/06
Inventor 沈芾云雷聪何明展徐筱婷
Owner QING DING PRECISION ELECTRONICS HUAIAN CO LTD
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