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SIP integrated circuit packaging structure fused with SMT

A technology of integrated circuit and packaging method, which is applied in the direction of circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of low precision and slow speed, and achieve the effects of improving production efficiency, reducing production cost, and increasing chip loading speed

Active Publication Date: 2019-01-25
WUXI HAOBANG HIGH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when a variety of components are packaged, active devices such as MOS, passive devices such as resistors and capacitors, and silicon chips are packaged in the same package, the 0.05mm 2 Soldering resistors and capacitors with 1mm-level silicon chips are slow in speed and low in precision

Method used

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  • SIP integrated circuit packaging structure fused with SMT
  • SIP integrated circuit packaging structure fused with SMT
  • SIP integrated circuit packaging structure fused with SMT

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] Embodiment 1, see figure 1 A resistance, a triode and a chip are arranged on a lead frame of a SIP integrated circuit packaging structure integrated with SMT. The resistor and the triode are welded on the lead frame with solder paste, and the chip is pasted on the lead frame with silver glue.

[0084]

[0085]

Embodiment 2

[0086] Embodiment 2, see figure 2 A capacitor, a MOS tube and a chip are arranged on the lead frame of a SIP integrated circuit packaging structure integrated with SMT. Capacitors and MOS tubes are welded on the lead frame with solder paste, and chips are pasted on the lead frame with silver glue.

[0087]

Embodiment 3

[0088] Embodiment 3, see image 3 A resistor, a common silicon and a chip are arranged on a lead frame of a SIP integrated circuit packaging structure integrated with SMT. Resistors and ordinary silicon are welded on the lead frame with solder paste, and the chip is pasted on the lead frame with silver glue.

[0089]

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PUM

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Abstract

The invention relates to a SIP integrated circuit packaging structure fused with SMT, which is characterized in that the SIP integrated circuit packaging structure comprises a metal lead frame, an active device and a passive device are soldered on the metal lead frame through solder paste, and a chip is bonded on the metal lead frame through silver glue. Active devices are discrete devices or integrated circuits, passive devices are resistors, inductors, or capacitors, and discrete devices are diodes, transistors, MOSFETs, or thyristors. The SIP integrated circuit packaging structure integrated with SMT of the invention has the advantages of improving production efficiency, reducing production cost and ensuring product quality.

Description

technical field [0001] The invention relates to a SIP integrated circuit packaging method integrated with SMT. Background technique [0002] The traditional SIP integrated circuit packaging structure is generally produced in one form of primary packaging or secondary packaging. [0003] First-level packaging refers to the packaging of components and various chips on a metal lead frame, and the chip is mounted on the lead frame through silver glue. [0004] Secondary packaging refers to various components and integrated circuits, which are soldered on the circuit board by SMT. SMT is Surface Mount Technology (Surface Mount Technology) (abbreviation for Surface Mount Technology), known as surface mount or surface mount technology. It is the most popular technology and process in the electronic assembly industry. SMT is a kind of non-pin or short-lead surface mount components (SMC / SMD for short, Chinese called chip components) mounted on the surface of the printed circuit bo...

Claims

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Application Information

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IPC IPC(8): H01L21/60H01L23/488H01L21/67H05K3/34
CPCH01L24/29H01L24/83H05K3/341H01L21/67144H01L21/67207H01L2224/29147H01L2224/29139H01L2224/29111H01L2224/831H05K3/3485H01L2224/48137H01L2224/48247
Inventor 张巧杏袁野全庆霄潘小华符爱风
Owner WUXI HAOBANG HIGH TECH CO LTD
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