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Plate structure multi-defect detection method based on DBSCAN and k-means algorithm

A defect detection and algorithm technology, applied in measuring devices, processing response signals of detection, and analyzing solids using sonic/ultrasonic/infrasonic waves, to achieve the effects of reducing manual intervention, high engineering application value, and eliminating external noise

Active Publication Date: 2019-01-29
EAST CHINA UNIV OF SCI & TECH
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Problems solved by technology

However, most of the current research is in the case of known single defect, and it is still impossible to determine the number of defects and the location of defects in the case of multiple defects and unknown number of defects.

Method used

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  • Plate structure multi-defect detection method based on DBSCAN and k-means algorithm
  • Plate structure multi-defect detection method based on DBSCAN and k-means algorithm
  • Plate structure multi-defect detection method based on DBSCAN and k-means algorithm

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Embodiment Construction

[0049] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. This embodiment is carried out on the premise of the technical solution of the present invention, and detailed implementation methods and specific operation processes are given, but the protection scope of the present invention is not limited to the following embodiments.

[0050] Such as figure 1 As shown, this example provides a multi-defect detection method for board structures based on DBSCAN and k-means algorithm, including the following steps:

[0051] Step S101: Arranging a sensor array on a board structure.

[0052] This embodiment adopts circular sensor array, its structure is as follows figure 2 shown. A sensor array composed of 16 circular piezoelectric wafers is arranged in the center of an aluminum plate of 1000mm×1000mm×3mm, and the array type is a circular sparse array. Among them, the diameter of the piezoelectric chip is 1...

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Abstract

The invention relates to a plate structure multi-defect detection method based on DBSCAN and k-means algorithm. The method comprises the following steps: 1) collecting a damage signal of a plate structure, and performing difference processing on the damage signal and a health signal acquired under the same condition to acquire a difference signal; 2) acquiring a direct wave difference feature signal based on the difference signal; 3) determining candidate defect data points based on a pre-selected feature signal threshold; 4) performing defect quantitation and positioning by utilizing the DBSCAN and k-means algorithm according to the candidate defect data points. Compared with the prior art, the defect amount can be accurately judged by utilizing an intelligent algorithm when multiple defects are existent and the amount of the defect is unknown, the influences from the external noises, the frequency dispersion of the Lamb wave, the boundary reflection and the modal conversion at the defect can be effectively eliminated, the signal-to-noise ratio is improved, multi-defect can be accurately positioned, and the method has relatively high engineering application value.

Description

technical field [0001] The present invention relates to the technical field of ultrasonic guided wave non-destructive testing of plate structures, in particular to a multi-defect detection method for plate structures based on DBSCAN and k-means algorithm, which solves how to determine the number of defects in the case of multiple defects and unknown number of defects and defect location. Background technique [0002] Lamb wave has fast propagation speed, large detection range, high sensitivity, and small attenuation. It can realize high-efficiency detection of plate structures and no blind spots. It has become one of the non-destructive testing methods that have attracted wide attention. When using Lamb wave to carry out non-destructive testing of defects in the board, due to the influence of external noise, Lamb wave dispersion, boundary reflection and mode conversion at the defect, there are some data with large errors in the large amount of data measured in the board , t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N29/04G01N29/44
CPCG01N29/041G01N29/4472G01N2291/0423
Inventor 周邵萍陈超峰翟双苗胡刚毅陈少杰
Owner EAST CHINA UNIV OF SCI & TECH
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