Ball grid array chip and welding method thereof
A solder ball array packaging and soldering method technology, which is applied in the layout details of conductive patterns, printed circuit components, electrical components, etc., can solve the problem of inconsistent solder ball soldering effects, inconsistent solder paste printing volume, and inaccurate pad positions, etc. problems, to achieve the effect of improving welding efficiency, reducing preparation costs, and reducing the use of materials
Inactive Publication Date: 2019-02-05
深圳市心版图科技有限公司
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Problems solved by technology
[0003] (1). There are many soldering points on the solder ball array package chip, and the corresponding stencil openings are also many, and the openings are very small. When the stencil is used to print solder paste, the printing amount of solder paste on individual pads will appear. Inconsistency, resulting in inconsistent welding effects of each solder ball
[0004] (2). Sometimes the solder balls of the solder ball array package chip and the solder pads of the printed circuit board are not aligned, and it is difficult to detect. Since it is necessary to use an X-ray machine for transmission inspection after soldering, This will not only increase the cost, but also reduce the production efficiency
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[0020] In order to understand the specific technical solutions, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0021] In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "transverse", "longitudinal", "horizontal", "inner", "outer" etc. indicate The orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that is usually placed when the product of the invention is used, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the It should not be construed as limiting the invention that a device or element must have a particular orientation, be constructed, and operate in a particular ...
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The invention provides a ball grid array chip. The chip includes a printed circuit board, a chip substrate arranged on the printed circuit board and a welding part connecting the printed circuit boardand the chip substrate; the printed circuit board includes a welding surface, at least two first welding areas formed on the welding surface at intervals, and multiple second welding areas arranged between the first welding areas; the first welding areas include grooves opened on the welding surface, first bonding pads located at the bottoms of the grooves and paste masks formed on the first bonding pads; the second welding areas include multiple second bonding pads; the diameters of the first bonding pads are greater than that of the second bonding pads; the chip substrate includes a ball mounting surface corresponding to the welding surface, and the welding part arranged on the ball mounting surface; the welding part includes first solder balls corresponding to the first bonding pads, and second solder balls corresponding to the second bonding pads; and the diameters of the first solder balls are greater than that of the second solder balls. A welding method of the chip is also provided. Thus, preparation costs can be reduced, and welding efficiency and precision can be enhanced.
Description
technical field [0001] The invention relates to the technical field of circuit board assembly, in particular to a solder ball array packaging chip and a welding method thereof. Background technique [0002] Due to the particularity of its packaging structure, the ball grid array package chip (BGA) has its pins set at the bottom of the entire package body, and the ball grid array package is performed on the printed circuit board (PCB). Chip placement and reflow soldering usually have the following disadvantages: [0003] (1). There are many soldering points on the solder ball array package chip, and the corresponding stencil openings are also many, and the openings are very small. When the stencil is used to print solder paste, the printing amount of solder paste on individual pads will appear. Inconsistency, resulting in inconsistent welding effects of each solder ball. [0004] (2). Sometimes the solder balls of the solder ball array package chip and the solder pads of th...
Claims
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IPC IPC(8): H01L23/488H01L21/60H05K1/02
CPCH01L24/14H01L24/81H01L2224/1403H01L2224/14131H01L2224/81191H01L2224/81986H05K1/0296H01L2224/14
Inventor 不公告发明人
Owner 深圳市心版图科技有限公司