Degumming machine for semiconductor processing

Abstract

The invention relates to the field of semiconductors, in particular to a glue removal machine for semiconductor processing. According to the glue removal machine for semiconductor processing, large-scale glue removing can be achieved, and dry glue is conveniently collected. The glue removal machine for semiconductor processing comprises a mounting plate, a first bracket, a first sliding block, a second bracket, a motor, a screw rod, a first bearing seat, a second bearing seat, a nut, a connecting block, a telescopic block and the like; the first bracket and the second bracket are sequentiallyand fixedly connected to the top face of the mounting plate, and the first bracket is provided with a first sliding groove; the motor is fixedly connected to the top face of the mounting plate, and the first bearing seta is fixedly connected to the side of the first bracket; a covering plate is fixedly connected to the tops of the first bracket and the second bracket; and the second bearing seat is fixedly connected to the bottom face of the covering plate. The glue removal machine achieves the effects of large-scale glue removing and convenient collecting of the dry glue.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a glue remover for semiconductor processing. Background technique [0002] A semiconductor is a material whose electrical conductivity can be controlled, ranging from an insulator to a conductor. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one in commercial applications among various semiconductor materials. Most of today's electronic products, such as computers, mobile phones or The core units in digital recorders are closely related to semiconductors. The integrated circuits required by computers are composed of transistors based on semiconductors. The manufacturing process of these semiconductor boards is roughly divided into epitaxial wafers, long silicon dioxide, uniform Glue, exposure, photolithography, silica candle engraving, glue removal, ICP, ITO plating, etc., glue removal is one of them, and the ...

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Problems solved by technology

[0003] The present invention overcomes the fact that most of the ordinary deglue processes are manually removed with a degumming brush, which takes time and effort, and cannot be degummed on a large scale, which affects production efficiency. During the degumming process, the dry glue on the semiconductor board will fly around, which is difficult The shortcoming of reclaiming, the technical problem to be solved in the present invention is to provide a kind of semiconductor processing degumming machine that can degumming on a large scale and conveniently collect dry glue

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