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Thermal interface material of surface modified graphene-carbon nitride-epoxy resin and preparation method of thermal interface material

A technology of thermal interface material and epoxy resin, which is applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of poor dispersion and interface compatibility, low thermal conductivity, etc., and achieve good dispersion and thermal conductivity. High, improve the effect of thermal conductivity

Active Publication Date: 2019-02-15
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention provides a thermal interface material with high thermal conductivity and a preparation method thereof in order to solve the technical problem of low thermal conductivity caused by poor dispersion and interfacial compatibility of existing graphene composite materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A thermal interface material of surface-modified graphene-carbon nitride-epoxy resin, the mass fraction of its components is as follows: graphene 2.5%, carbon nitride 2.5%, polyvinylpyrrolidone 1%, diethyl Toluenediamine 17% and epoxy resin 77%.

[0021] The curing agent is diethyltoluenediamine, the thickness of graphene is 1 nanometer, the particle size is 100 microns, the thermal conductivity is 1000W / mk, the diameter of carbon nitride is 1 nanometer, the length is 200 microns, and the epoxy resin is Bisphenol A type epoxy resin E-51.

[0022] The preparation method of the thermal interface material of surface modified graphene-carbon nitride-epoxy resin is:

[0023] (1) Ultrasonic treatment of graphene and carbon nitride: 2 grams of graphene powder and 1 gram of carbon nitride powder were placed in deionized water, and the volume of deionized water was 300 ml. Ultrasonic treatment at room temperature for 8 hours, suction filtration and washing with deionized water...

Embodiment 2

[0028] A thermal interface material of surface-modified graphene-carbon nitride-epoxy resin, the mass fraction of its components is as follows: graphene 5%, carbon nitride 5%, polyvinylpyrrolidone 1%, diethyl Toluenediamine 19% and epoxy resin 70%.

[0029] The curing agent is diethyltoluenediamine, the thickness of the graphene is 250 nanometers, the particle size is 50 microns, and the thermal conductivity is 2500 W / mk. The carbon nitride has a diameter of 250 nanometers and a length of 100 micrometers. The epoxy resin is bisphenol A type epoxy resin E-51.

[0030] The preparation method of the thermal interface material of surface modified graphene-carbon nitride-epoxy resin is:

[0031] (1) Ultrasonic treatment of graphene and carbon nitride: 3.5 grams of graphene powder and 1 gram of carbon nitride powder were placed in deionized water, and the volume of deionized water was 1125 ml. Ultrasonic treatment for 10 h at room temperature, suction filtration and washing with ...

Embodiment 3

[0036] A thermal interface material of surface-modified graphene-carbon nitride-epoxy resin, the mass fraction of its components is as follows: graphene 10%, carbon nitride 10%, polyvinylpyrrolidone 1%, diethyl Toluenediamine 24% and epoxy resin 65%.

[0037]The curing agent is diethyltoluenediamine, the thickness of graphene is 500 nanometers, the particle size is 1 micron, the thermal conductivity is 5000W / mk, the diameter of carbon nitride is 500 nanometers, and the length is 1 micron, and the epoxy resin is Bisphenol A type epoxy resin E-51.

[0038] The preparation method of the thermal interface material of surface modified graphene-carbon nitride-epoxy resin is:

[0039] (1) Ultrasonic treatment of graphene and carbon nitride: 5 grams of graphene powder and 1 gram of carbon nitride powder were placed in deionized water, and the volume of deionized water was 2400 ml. Ultrasonic treatment at room temperature for 12 hours, suction filtration and washing with deionized wa...

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Abstract

The invention relates to a thermal interface material of surface modified graphene-carbon nitride-epoxy resin and a preparation method of the thermal interface material, and solves the problem of lowthermal conductivity caused by poor dispersibility and interface compatibility of an existing graphene composite material. The thermal interface material comprises the following components by mass percentage: 2.5-10% of graphene, 2.5-10% of carbon nitride, 17-24% of diethyltoluenediamine, 65-77% of epoxy resin and the balance of polyvinylpyrrolidone. The invention also provides the preparation method of the thermal interface material. The thermal interface material provided by the invention can be widely applied to the field of preparation of thermally conductive composite materials.

Description

technical field [0001] The invention relates to the field of heat-conducting composite materials, in particular to a surface-modified graphene-carbon nitride-epoxy resin thermal interface material and a preparation method thereof. Background technique [0002] Thermal interface material is a heat dissipation material used in the packaging of electronic products. It can fill the micro-voids and holes caused by the uneven surface of the material itself due to insufficient bonding or contact between the two materials, thereby reducing the gap between the two. The thermal impedance between them finally achieves the purpose of improving thermal conductivity. Traditional thermal interface materials are usually composite materials prepared by uniformly dispersing one-dimensional or two-dimensional fillers with relatively high thermal conductivity into the polymer matrix. Higher thermal conductivity powder materials include boron nitride, carbon nanotubes, Graphite, aluminum or oth...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L39/06C08K13/06C08K9/00C08K3/28C08K3/04C09K5/14
CPCC08K2201/003C08K2201/004C08L63/00C09K5/14C08L39/06C08K13/06C08K9/00C08K3/28C08K3/042
Inventor 兰金叻张浩远杨小平原浩成
Owner BEIJING UNIV OF CHEM TECH
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