Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Device and method for cooling semiconductor devices of underground tools

A downhole tool and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as permanent damage, response reduction, device failure, etc., and achieve low cooling power consumption, lighten the burden, The effect of low power consumption

Inactive Publication Date: 2019-02-15
XI'AN PETROLEUM UNIVERSITY
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

High temperatures can cause drift, non-linear response, reduced response, or even complete failure of these devices at high temperatures
Usually, devices regain their original performance when returned to room temperature, but sometimes they can be permanently damaged by exposure to such high temperatures

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device and method for cooling semiconductor devices of underground tools
  • Device and method for cooling semiconductor devices of underground tools
  • Device and method for cooling semiconductor devices of underground tools

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Such as figure 1 As shown, the device for cooling a semiconductor device of a downhole tool in this embodiment includes a semiconductor device 102 operable in a downhole environment. Semiconductor device 102 may be disposed on active cooling layer 104 , and active cooling layer 104 is disposed on heat sink 106 . Certainly, in order to dissipate the heat in the radiator 106 better, the radiator 106 can be arranged on the heat dissipation device 108 . In this embodiment, heat dissipation device 108 may be a high capacity thermal capacity heat sink with sufficient heat capacity to minimize the temperature rise of the die as it is cooled, thereby allowing the die to reach its lowest possible temperature to maximize the thermoelectric cooler. efficiency. For devices that require cooling to improve their performance but are not damaged by drilling temperatures, intermittent but rapid cooling to the desired temperature is possible due to the high heat pump capability of the ...

Embodiment 2

[0039] refer to figure 2 , the device for cooling a semiconductor device of a downhole tool in this embodiment includes a semiconductor device disposed on an active cooling layer 104 , and the active cooling layer 104 is disposed on a radiator 106 . Certainly, in order to dissipate the heat in the radiator 106 better, the radiator 106 can be arranged on the heat dissipation device 108 . Wherein the semiconductor device in this embodiment is the electromagnetic energy source 202 , the device for cooling the semiconductor device of the downhole tool in this embodiment can be packaged, which includes the electromagnetic energy source 202 arranged in the package 206 . The electromagnetic energy source 202 in this example is an electromagnetic energy emitter that emits electromagnetic energy 204, and the package 206 includes a window 208 that allows the electromagnetic energy emitter 204 to emit from the package 206, the package 206 can include a base 210, and the base 210 can On...

Embodiment 3

[0041] Such as image 3 As shown, the device for cooling the semiconductor device of the downhole tool in this embodiment includes the semiconductor device disposed on the active cooling layer 104 , and the active cooling layer 104 is disposed on the radiator 106 . Certainly, in order to dissipate the heat in the radiator 106 better, the radiator 106 can be arranged on the heat dissipation device 108 . The semiconductor device in this embodiment is the sensing element 302 of the detector. The sensing element 302 of the detector, the active cooling layer 104 , the heat sink 106 and the heat dissipation device 108 may then be disposed on one or more substrates 312 suitable for mounting the device within the detector package 306 .

[0042] Package 306 may also include window 308 for allowing electromagnetic energy to enter package 306 and be detected by detector 302 . The package may include a base 310 and one or more electrical leads 314 for mounting the package in a downhole ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a device and method for cooling semiconductor devices of underground tools. The device for cooling semiconductor devices of underground tools comprises a semiconductor device,an active cooling layer and a radiator, wherein the semiconductor device is arranged on the upper end surface of the active cooling layer; the lower end surface of the active cooling layer is in contact with the radiator; and the active cooling layer is a thin-film thermoelectric cooling layer. During the use, a semiconductor device of an underground tool is transported to an underground position,the thin-film thermoelectric cooling layer is used for absorbing heat from the semiconductor device of the underground tool, and the radiator connected with the thin-film thermoelectric cooling layeris used for pumping heat from the thin-film thermoelectric cooling layer. The device and method are capable of enabling the underground tools and well logging devices to work periodically and enabling cooling systems to maintain the normal work of the underground tools and the well logging devices with minimum cost.

Description

technical field [0001] The invention relates to the field of downhole tools, in particular to a device and method for cooling semiconductor devices of downhole tools. Background technique [0002] Oil and gas wells are drilled to depths of hundreds to thousands of meters. Logging and drilling equipment usually contains various sensors, instrumentation and controls in order to perform any possible downhole operations. These downhole operations may include performing well logging, fluid analysis, and equipment monitoring. [0003] Due to vibration, harsh chemicals, and temperature, the downhole environment poses a great challenge to maintaining the operation of downhole tools deep downhole. Among them, the temperature has brought great challenges to the application of downhole tools. Downhole temperatures may reach 392°F (200°C) or higher, making it difficult to operate sensitive electronic components in the downhole environment. The space on the downhole carrier is usually...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/373H01L23/38H01L23/473
CPCH01L23/3672H01L23/3736H01L23/38H01L23/473
Inventor 尚海燕宋超周静傅杰
Owner XI'AN PETROLEUM UNIVERSITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com