Dressing apparatus and dressing method for substrate rear surface polishing member

A technology of back grinding and dressing device, applied in grinding device, abrasive surface adjustment device, grinding/polishing safety device, etc., can solve the problems of reduced grinding performance and inability to achieve grinding treatment, etc.

Active Publication Date: 2019-02-26
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, in the polishing process using such a polishing member, residues (swarf) are generated during polishing. If the residues enter the pores, grooves, etc. of the polishing pad, the polishing performance will be reduced, and sometimes the desired polishing process cannot be achieved.

Method used

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  • Dressing apparatus and dressing method for substrate rear surface polishing member
  • Dressing apparatus and dressing method for substrate rear surface polishing member
  • Dressing apparatus and dressing method for substrate rear surface polishing member

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Embodiment Construction

[0059] Below, while referring to the attached Figure 1 Embodiments of the present invention will be described. In addition, in this specification and drawings, the same code|symbol is attached|subjected to the element which has substantially the same functional structure, and repeated description is abbreviate|omitted.

[0060]

[0061] First, the configuration of a substrate processing system including the trimming device of the present embodiment will be described. figure 1 It is a schematic plan view schematically showing the configuration of the substrate processing system 1 . figure 2 and image 3 It is a front view and a rear view which schematically show the internal structure of the substrate processing system 1, respectively. In the substrate processing system 1 , predetermined processing is performed on a wafer W as a substrate to be processed.

[0062] Substrate processing system 1 such as figure 1 As shown, it has a structure in which the following parts...

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PUM

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Abstract

The invention relates to a dressing apparatus and a dressing method for a substrate rear surface polishing member. When the polishing member for polishing the back surface of the substrate is cleanedand trimmed, the cleaning liquid and the residue are not scattered around. The dressing apparatus 200 includes a bus member 203 which is equipped with a ceiling plate 201 and a circular or polygonal cylindrical skirt portion 202 provided at a bottom surface of the ceiling plate 201 and which is configured to accommodate a polishing pad 131 from thereabove. The bus member 203 includes a dual fluidnozzle 204 configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad 131; a dress board 205 configured to come into contact with the polishing surface of the polishing pad 131; and a rinse nozzle 206 configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad 131 and the dress board 205. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion 202.

Description

technical field [0001] The present invention relates to a dressing device and a dressing method of a grinding member on the back surface of a substrate. Background technique [0002] For example, in the manufacturing process of a semiconductor device, the back surface of a semiconductor wafer (in the following description, sometimes simply referred to as a wafer) is polished using a polishing member such as a polishing pad before exposing a pattern, and the substrate is lifted. The flatness of the back, no scratches, dirt, eliminate processing strain. [0003] However, in the polishing process using such a polishing member, residues (swarf) are generated during polishing, and if the residues enter the pores, grooves, etc. of the polishing pad, the polishing performance is reduced, and the desired polishing process may not be achieved. [0004] In view of this problem, in order to maintain the performance of the polishing pad in an appropriate range, the polishing pad is reg...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00B24B55/00
CPCB24B1/00B24B55/00B24B27/0084B24B37/105B24B49/12B24B53/007B24B53/095B24B53/14B24B53/017H01L21/67092H01L21/67051H01L21/304H01L21/02052B24B37/042B24B37/205
Inventor 冈本芳树滝口靖史久保明广保坂隼斗小篠龙人
Owner TOKYO ELECTRON LTD
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