Check patentability & draft patents in minutes with Patsnap Eureka AI!

Polyimide precursor composition and method for producing polyimide film using the same

A technology of polyimide and composition, applied in the field of display devices, can solve problems such as coating surface defects, and achieve the effect of good transmittance and surface characteristics

Active Publication Date: 2019-02-26
DONGJIN SEMICHEM CO LTD
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when the high-temperature process (120°C process start and 450°C cure process) and high-speed drying are performed, defects are generated on the coated surface due to the rapid evaporation of the solvent. In order to improve this problem, various methods have been tried.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polyimide precursor composition and method for producing polyimide film using the same
  • Polyimide precursor composition and method for producing polyimide film using the same
  • Polyimide precursor composition and method for producing polyimide film using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] [Example 1] Preparation of polyimide precursor composition :

[0042] In a mixed solvent of 529.2 g of 3-methoxy-N,N-dimethylpropanamide (M3DMPA) and N,N-dimethylpropanamide (DMPA) at a ratio of 1:9 by weight After completely dissolving 21.62g (0.2mol) of p-phenylenediamine (PPDA) at room temperature, add 58.84g (0.2mol) of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) to carry out The reaction was completed after stirring for 18 hours, and a composition containing 15 parts by weight of polyamic acid (polyimide precursor) was obtained with respect to 100 parts by weight of the mixed solvent. In order to confirm that polymerization proceeds smoothly and whether thin film formation is possible, the viscosity of the composition was detected using a Brookfield viscometer, and the obtained polyamic acid composition had a viscosity of 13500 cps.

Embodiment 2

[0043] [Example 2] Preparation of polyimide precursor composition :

[0044] The mixing ratio of 3-methoxy-N,N-dimethylpropionamide (M3DMPA) and N,N-dimethylpropionamide (DMPA) is 3:7, except that, by the same method as in Example 1 The method obtained polyamic acid (polyimide precursor) composition. The obtained polyamic acid composition had a viscosity of 13000 cps.

Embodiment 3

[0045] [Example 3] Preparation of polyimide precursor composition :

[0046] The mixing ratio of 3-methoxy-N,N-dimethylpropionamide (M3DMPA) and N,N-dimethylpropionamide (DMPA) is 5:5, except that, by the same method as in Example 1 The method obtained polyamic acid (polyimide precursor) composition. The obtained polyamic acid composition had a viscosity of 12500 cps.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
boiling pointaaaaaaaaaa
boiling pointaaaaaaaaaa
transmittivityaaaaaaaaaa
Login to View More

Abstract

The invention discloses a polyimide precursor composition which can be applied to a flexible substrate, a method for producing a polyimide film using the same and a display device comprising the polyimide film. The polyimide precursor composition comprises a mixed solvent containing 3-methoxy-N, N-dimethyl propionamide (M3DMPA) and N, N-dimethyl propionamide (DMPA) and polyamic acid or polyimide.

Description

technical field [0001] The present invention relates to a polyimide precursor composition and a method for preparing a polyimide film using the same, in more detail, to a polyimide precursor composition that can be used for the preparation of a flexible substrate, a polyimide A method for preparing an amine film and a display device comprising a polyimide film. Background technique [0002] Recently, demand for flat panel displays (Flat Panel Displays; FPDs) that can easily realize a large area and can be thinned and lightened is increasing. Such a flat panel display includes a liquid crystal display (Liquid Crystal Display; LCD), a plasma display panel (Plasma Display Panel; PDP), an organic light emitting display (Organic Light Emitting Display; OLED) and the like. However, conventional flat panel displays use glass substrates, so they are not flexible, and their applications and uses are limited. Therefore, as a next-generation display device, a flexible display device ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08L79/08C08J5/18
CPCC08G73/1007C08G73/1067C08G73/1071C08J5/18C08J2379/08C08G73/1032C08L79/08G02F1/133305G02F1/13338G06F3/041
Inventor 车荣哲安民石朴势周郑载勋裴珉英赵英云金东敏
Owner DONGJIN SEMICHEM CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com