Device and method applied to ion beam etching sputtering protection

Abstract

The invention relates to a device and method applied to ion beam etching sputtering protection. The device mainly comprises a cylindrical shielding cylinder and a base support, wherein the cylindricalshielding cylinder is arranged on a front-surface support. The device is integrally arranged in a vacuum chamber cabin door and is in right front of a workbench, the position of the cylindrical shielding cylinder can be adjusted by the base support and the front-surface support, so that the cylindrical shielding cylinder and a push stop plate of the workbench are arranged on the same horizontal surface; and after the push stop plate is arranged at a target of the workbench, sputtering protection is performed on the push stop plate, so that deep tolerance of an etching push stop plate caused by ion sputtering during the ion beam etching process is reduced, and the accuracy requirement of a gyro is met.

Description

technical field [0001] The present invention relates to the technical field of ion beam etching, in particular to a device and method for ion beam etching sputtering protection, the main purpose of which is to reduce the etching thrust caused by ion sputtering in the ion beam etching process The depth of the plate groove is out of tolerance. Background technique [0002] The gyroscope uses a dynamic pressure air bearing motor, and the motor thrust plate is a key part of the thrust bearing. The uniformity of the groove depth of the spiral groove is an important parameter to realize an effective air bearing, which directly affects the support performance and operation stability of the motor. At present, the helical groove of the thrust plate of the gyroscope motor is processed by ion beam etching. [0003] The essence of ion beam etching is a processing method in which high-energy ion flow hits the surface of the part, and the atoms hit by the hit are separated from the body ...

AI Technical Summary

Problems solved by technology

After the ion flow enters the vacuum chamber, most of it is directly shot at the target material of the workpiece table, and has a frontal impact on the thrust plate on the workpiece table, but some of the ion flow will splash in the vacuum chamber in a disordered state, and finally from Impacting the thrust plate at different angles, due to the disordered and irregular impact angle and speed, is the biggest factor causing the depth of the etched groove of the thrust plate to be out of tolerance and poor in uniformity

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